rf inductors Recently Published Documents

Intrinsic stress-induced bending as a platform technology for controlled self-assembly of high-Q on-chip RF inductors

Journal of Micromechanics and Microengineering ◽

10.1088/1361-6439/ab16bd ◽

2019 ◽

Vol 29 (6) ◽

pp. 064002 ◽

Author(s):

Rayan Bajwa ◽

Murat Kaya Yapici

Keyword(s):

Self Assembly ◽

Intrinsic Stress ◽

High Q ◽

Platform Technology ◽

On Chip ◽

RF Inductors Integrated in Organic Packaging

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2019.00258 ◽

2019 ◽

Author(s):

Denis Mercier ◽

Jean-Philippe Michel ◽

Christine Raynaud ◽

Christophe Billard

Keyword(s):

Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2018.2807416 ◽

2018 ◽

pp. 1-10 ◽

Author(s):

Min Suk Kim ◽

Markondeya Raj Pulugurtha ◽

Venky Sundaram ◽

Rao R. Tummala ◽

Hobie Yun

Keyword(s):

High Q ◽

Superparamagnetic, nanocrystalline cobalt ferrite thin films as magnetic core of integrated RF inductors

2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO) ◽

10.1109/nano.2017.8117347 ◽

2017 ◽

Author(s):

Neelima Sangeneni ◽

Navakanta Bhat ◽

S. A. Shivashankar

Keyword(s):

Thin Films ◽

Cobalt Ferrite ◽

Magnetic Core ◽

Ferrite Thin Films ◽

RF inductors with sputtered nanomagnetic films on glass substrates

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-017-7396-2 ◽

2017 ◽

Vol 28 (20) ◽

pp. 15184-15194

Author(s):

Junki Min ◽

Minsuk Kim ◽

Teng Sun ◽

P. Markondeya Raj ◽

Rao Tummala

Keyword(s):

Glass Substrates ◽

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

Characterization of through glass via (TGV) RF inductors

10.1109/impact.2016.7800071 ◽

2016 ◽

Cited By ~ 2

Author(s):

Yu-Chang Hsieh ◽

Yung-Shun Chang ◽

Teck Chong Lee ◽

Chen-Chao Wang

Keyword(s):

Inkjet Printed High-Q RF Inductors on Paper Substrate With Ferromagnetic Nanomaterial

IEEE Microwave and Wireless Components Letters ◽

10.1109/lmwc.2016.2555881 ◽

2016 ◽

Vol 26 (6) ◽

pp. 419-421 ◽

Cited By ~ 13

Author(s):

Hoseon Lee ◽

Benjamin S. Cook ◽

K. P. Murali ◽

Markondeya Raj ◽

Manos M. Tentzeris

Keyword(s):

Paper Substrate ◽

High Q ◽

Hybrid cylindrical radial superlattice conductor-based air-lifted RF inductors with ultra-high quality factor for UWB and K-bands

2016 IEEE MTT-S International Microwave Symposium (IMS) ◽

10.1109/mwsym.2016.7539971 ◽

2016 ◽

Author(s):

Arian Rahimi ◽

Yong-Kyu Yoon

Keyword(s):

Quality Factor ◽

High Quality Factor ◽

High Quality ◽

High-Performance RF Inductors and Capacitors Using the Reverse Trench Structure of Silicon

IEEE Microwave and Wireless Components Letters ◽

10.1109/lmwc.2015.2479841 ◽

2015 ◽

Vol 25 (11) ◽

pp. 709-711 ◽

Cited By ~ 8

Author(s):

Jong-Min Yook ◽

Dongsu Kim ◽

Jun Chul Kim

Keyword(s):

High Performance ◽

Trench Structure ◽