High-Q RF inductors on standard silicon realized using wafer-level packaging techniques

IEEE MTT-S International Microwave Symposium Digest, 2003 ◽

10.1109/mwsym.2003.1212605 ◽

2003 ◽

Author(s):

G. Carchon ◽

S. Jenei ◽

L. Carbonell ◽

M. Van Hove ◽

S. Decoutere ◽

...

Keyword(s):

Wafer Level ◽

High Q ◽

Wafer Level Packaging ◽

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Suspended high Q integrated inductor by wafer level packaging technology

Microsystem Technologies ◽

10.1007/s00542-013-2010-x ◽

2013 ◽

Vol 21 (1) ◽

pp. 215-219 ◽

Author(s):

M. Han ◽

S. F. Wang ◽

G. W. Xu ◽

Le Luo

Keyword(s):

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Integrated Inductor ◽

Wafer Level Packaging

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Suspended of high-Q integrated inductors using wafer level packaging technologies

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756551 ◽

2013 ◽

Author(s):

Mei Han ◽

Le Luo ◽

Shuangfu Wang ◽

Tianxi Wang

Keyword(s):

Wafer Level ◽

High Q ◽

Integrated Inductors ◽

Wafer Level Packaging

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High-Q inductors and transmission lines on 20 Ω.cm Si using wafer-level packaging technology

2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2003. Digest of Papers. ◽

10.1109/smic.2003.1196682 ◽

2003 ◽

Author(s):

G. Carchon ◽

Xiao Sun ◽

W. De Raedt

Keyword(s):

Transmission Lines ◽

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging

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High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90 nm RF-CMOS 5 GHz VCO

2005 European Microwave Conference ◽

10.1109/eumc.2005.1608797 ◽

2005 ◽

Author(s):

X. Sun ◽

D. Linten ◽

O. Dupuis ◽

G. Carchon ◽

P. Soussan ◽

...

Keyword(s):

Thin Film ◽

Rf Cmos ◽

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

On Chip ◽

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RF characterization of mold compound materials and high-$Q$ integrated passives using fan-out wafer-level packaging technology

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc47984.2019.9026638 ◽

2019 ◽

Author(s):

Xiao Sun ◽

John Slabbekoorn ◽

Dimitrios Velenis ◽

Andy Miller ◽

Geert Van der Plas ◽

...

Keyword(s):

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

Integrated Passives ◽

Compound Materials

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Analysis of high-Q on-chip inductors realized by wafer-level packaging techniques

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216496 ◽

2004 ◽

Author(s):

X. Sun ◽

G. Carchon ◽

W. De Raedt ◽

E. Beyne

Keyword(s):

Wafer Level ◽

High Q ◽

Wafer Level Packaging ◽

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High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNA

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2006.884827 ◽

2006 ◽

Vol 29 (4) ◽

pp. 810-817 ◽

Author(s):

Xiao Sun ◽

Olivier Dupuis ◽

Dimitri Linten ◽

Geert Carchon ◽

Philippe Soussan ◽

...

Keyword(s):

Thin Film ◽

Rf Cmos ◽

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

5 Ghz ◽

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High performance RF inductors integrated in advanced Fan-Out wafer level packaging technology

2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems ◽

10.1109/sirf.2012.6160146 ◽

2012 ◽

Author(s):

Cedric Durand ◽

Frederic Gianesello ◽

Romain Pilard ◽

Daniel Gloria ◽

Yvon Imbs ◽

...

Keyword(s):

High Performance ◽

Wafer Level ◽

Packaging Technology ◽

Wafer Level Packaging ◽

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Design and fabrication of suspended high Q MIM capacitors by wafer level packaging technology

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236551 ◽

2015 ◽

Author(s):

Tao Zheng ◽

Mei Han ◽

Gaowei Xu ◽

Le Luo ◽

Tao Zheng

Keyword(s):

Wafer Level ◽

Packaging Technology ◽

High Q ◽

Wafer Level Packaging ◽

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High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging

2019 IEEE Custom Integrated Circuits Conference (CICC) ◽

10.1109/cicc.2019.8780183 ◽

2019 ◽

Author(s):

Farrokh Ayazi ◽

Haoran Wen ◽

Yaesuk Jeong ◽

Pranav Gupta ◽

Anosh Daruwalla ◽

...

Keyword(s):

Inertial Measurement Unit ◽

Measurement Unit ◽

Wafer Level ◽

Inertial Measurement ◽

High Q ◽

Wafer Level Packaging

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