scholarly journals Enhancing the local conductivity of Cu films using temperature-assisted agglomerated Cu nanostructures

2019 ◽  
Vol 53 (9) ◽  
pp. 09LT02 ◽  
Author(s):  
Jiwoong Kim ◽  
Tae-Seong Ju ◽  
Sehwan Song ◽  
Dooyong Lee ◽  
Sam Yeon Cho ◽  
...  
Keyword(s):  
Cu Films ◽  
Local Conductivity ◽  
Cu Nanostructures

Formation and Evolution of Cu Nanostructures on the Surface of Nanosized Cu Films under High Vacuum Annealing

2011 ◽  
Vol 361-363 ◽  
pp. 1582-1588
Author(s):  
Jiang Bin Su ◽  
Lun Xiong Li ◽  
Xian Fang Zhu
Keyword(s):  
Thermal Activation ◽  
Vacuum Annealing ◽  
High Vacuum ◽  
Film Surface ◽  
Activation Effect ◽  
Cu Films ◽  
Full Explanation ◽  
Formation And Evolution ◽  
20 Nm ◽  
Cu Nanostructures

Nanosized Cu films were prepared by direct current (dc) magnetron sputtering method at room temperature. The as-deposited Cu films were subsequently annealed under high vacuum annealing for different time. It was observed that with the annealing various types of Cu nanostructures formed on the surface of films. It was also observed that the appropriate range of film thickness for such formation was from 20 nm to 40 nm. During the annealing, three types of nanoparticles and considerable number of even tiny crystallites forming on the film surface were crucial for the formation. Furthermore, the detailed formation and evolution were studied and two possible mechanisms, i.e., surface nanocurvature effect and thermal activation effect, were proposed for a full explanation.

Precipitation in Al + 4% Cu Epitaxial Films

1968 ◽  
Vol 26 ◽  
pp. 384-385
Author(s):  
S. Herd ◽  
S. M. Mader
Keyword(s):  
Solid Solution ◽  
Bulk Material ◽  
Epitaxial Films ◽  
Detectable Change ◽  
Cu Films ◽  
Solution Treated ◽  
Single Crystal Films ◽  
Crystal Films ◽  
Diffraction Patterns ◽  
Deposited Films

Single crystal films in (001) orientation, about 1500 Å thick, were produced by R-F sputtering of Al + 4 wt % Cu onto cleaved KCl at 150°C substrate temperature. The as-deposited films contained numerous θ-CuAl2 particles (C16 structure) about 0.1μ in size. They were transferred onto Mo screens, solution treated and rapidly cooled (within about ½ min) so as to retain a homogeneous solid solution. Subsequently, the films were aged in vacuum at various temperatures in order to induce precipitation and to compare structures and morphologies of precipitate particles in Al-Cu films with those found in age hardened bulk material.Aging for 3 weeks at 60°C or 48 hrs at 100°C did not produce any detectable change in high resolution micrographs or diffraction patterns. In this range Guinier-Preston zones (GP) form in quenched bulk material. The absence of GP in the present experiments in this aging range is perhaps due to the cooling rate employed, which might be more equivalent to an aged and reverted bulk material than to a quenched one.

Some Properties and Structural Features of Poly(Vinyl Chloride)/Cu Films with Copper Nanoparticles Obtained by Exploding Wire Methodu

2020 ◽  
Vol 12 (4) ◽  
pp. 04032-1-04032-5
Author(s):  
V. V. Krivtsov ◽  
◽  
V. V. Kukla ◽  
V. V. Krivtsov ◽  
A. I. Shidlovskiy ◽  
...  
Keyword(s):  
Vinyl Chloride ◽  
Copper Nanoparticles ◽  
Structural Features ◽  
Exploding Wire ◽  
Cu Films ◽  
Poly Vinyl Chloride

scholarly journals Growth of TiO2/Cu films by HiPIMS for accelerated bacterial loss of viability

2013 ◽  
Vol 232 ◽  
pp. 804-813 ◽  
Author(s):  
Sami Rtimi ◽  
Oualid Baghriche ◽  
Cesar Pulgarin ◽  
Jean-Claude Lavanchy ◽  
John Kiwi
Keyword(s):  
Cu Films

Recrystallization-induced void migration in electroplated Cu films

2012 ◽  
Vol 67 (4) ◽  
pp. 312-315 ◽  
Author(s):  
Sunghwan Kim ◽  
Jin Yu
Keyword(s):  
Cu Films ◽  
Void Migration
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