Grain growth and damages induced by transient heat loads on W

Addition of small amounts of erbium has a profound effect on recrystallization and grain growth in titanium. Erbium, because of its negligible solubility in titanium, precipitates in the titanium matrix as a finely dispersed second phase. The presence of this phase, depending on its average size, distribution, and volume fraction in titanium, strongly inhibits the migration of grain boundaries during recrystallization and grain growth, and thus produces ultimate grains of sub-micrometer dimensions. A systematic investigation has been conducted to study the isothermal grain growth in electrolytically pure titanium and titanium-erbium alloys (Er concentration ranging from 0-0.3 at.%) over the temperature range of 450 to 850°C by electron microscopy.

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Microstructural characterization of a rapidly solidified Al-Fe-V-Si alloy for elevated temperature applications

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100104819 ◽

1988 ◽

Vol 46 ◽

pp. 550-551

Author(s):

R. E. Franck ◽

J. A. Hawk ◽

G. J. Shiflet

Keyword(s):

High Temperature ◽

Elevated Temperature ◽

Grain Growth ◽

Volume Fraction ◽

Microstructural Characterization ◽

Second Phase ◽

Microstructural Stability ◽

Elevated Temperature Strength ◽

Temperature Applications

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.

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Exposure of CFC-materials to high transient heat loads in the TEXTOR tokamak

Journal of Nuclear Materials ◽

10.1016/s0022-3115(96)00618-6 ◽

1997 ◽

Vol 241-243 (1) ◽

pp. 848-852 ◽

Cited By ~ 3

Author(s):

T Scholz

Keyword(s):

Heat Loads

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Computational heat affected zone microstructure simulation - Normal grain growth

International Congress on Applications of Lasers & Electro-Optics ◽

10.2351/1.5058850 ◽

1994 ◽

Cited By ~ 1

Author(s):

Meng-Yen Li ◽

Elijah Kannatey-Asibu

Keyword(s):

Grain Growth ◽

Heat Affected Zone ◽

Microstructure Simulation ◽

Zone Microstructure

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Microstructural Considerations on the Reliability of 3D Packaging

ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2012p0044 ◽

2012 ◽

Author(s):

Zhiheng Huang ◽

Zhiyong Wu ◽

Hua Xiong ◽

Yucheng Ma

Keyword(s):

Mechanical Behavior ◽

Grain Growth ◽

Spinodal Decomposition ◽

Elastic Energy ◽

Modeling Approach ◽

3D Packaging ◽

Ultrafine Interconnects

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.

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