Microstructural characterization of a rapidly solidified Al-Fe-V-Si alloy for elevated temperature applications

Author(s):  
R. E. Franck ◽  
J. A. Hawk ◽  
G. J. Shiflet

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.

Author(s):  
B. B. Rath ◽  
J. E. O'Neal ◽  
R. J. Lederich

Addition of small amounts of erbium has a profound effect on recrystallization and grain growth in titanium. Erbium, because of its negligible solubility in titanium, precipitates in the titanium matrix as a finely dispersed second phase. The presence of this phase, depending on its average size, distribution, and volume fraction in titanium, strongly inhibits the migration of grain boundaries during recrystallization and grain growth, and thus produces ultimate grains of sub-micrometer dimensions. A systematic investigation has been conducted to study the isothermal grain growth in electrolytically pure titanium and titanium-erbium alloys (Er concentration ranging from 0-0.3 at.%) over the temperature range of 450 to 850°C by electron microscopy.


Author(s):  
M. Larsen ◽  
R.G. Rowe ◽  
D.W. Skelly

Microlaminate composites consisting of alternating layers of a high temperature intermetallic compound for elevated temperature strength and a ductile refractory metal for toughening may have uses in aircraft engine turbines. Microstructural stability at elevated temperatures is a crucial requirement for these composites. A microlaminate composite consisting of alternating layers of Cr2Nb and Nb(Cr) was produced by vapor phase deposition. The stability of the layers at elevated temperatures was investigated by cross-sectional TEM.The as-deposited composite consists of layers of a Nb(Cr) solid solution with a composition in atomic percent of 91% Nb and 9% Cr. It has a bcc structure with highly elongated grains. Alternating with this Nb(Cr) layer is the Cr2Nb layer. However, this layer has deposited as a fine grain Cr(Nb) solid solution with a metastable bcc structure and a lattice parameter about half way between that of pure Nb and pure Cr. The atomic composition of this layer is 60% Cr and 40% Nb. The interface between the layers in the as-deposited condition appears very flat (figure 1). After a two hour, 1200 °C heat treatment, the metastable Cr(Nb) layer transforms to the Cr2Nb phase with the C15 cubic structure. Grain coarsening occurs in the Nb(Cr) layer and the interface between the layers roughen. The roughening of the interface is a prelude to an instability of the interface at higher heat treatment temperatures with perturbations of the Cr2Nb grains penetrating into the Nb(Cr) layer.


Author(s):  
Roman Sowa ◽  
Thomas Goehler ◽  
Lisa Dankl ◽  
Anna Kirzinger ◽  
Andrzej Budziak ◽  
...  

2014 ◽  
Vol 33 (3) ◽  
pp. 193-200 ◽  
Author(s):  
Jiteng Wang ◽  
Juan Wang ◽  
Yajiang Li ◽  
Deshuang Zheng

AbstractMolybdenum and molybdenum alloys are considered to be attractive structural materials for high-temperature applications. However, molybdenum alloys are sensitive to gas impurities and have the characteristics of low temperature embrittlement and less resistance to oxidation at elevated temperature. The toughness and strength of welded joint is not easy to be ensured by traditional technology. Recently, many efforts have been made to join molybdenum and its alloys. In this paper, we present the result of investigations on welding methods of molybdenum and its alloys and overview the practical applications in engineering. The key of joining molybdenum alloys is to improve the toughness of welded joint and prevent the generation of pores and cracks.


2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000148-000153
Author(s):  
Kenneth P. Dowhower

Abstract The electrical interconnect is an essential component of most electrical system configurations. The ability of the interconnect interface to reliably transmit power and / or data throughout the system is critical to its overall performance. Degradation of the mechanical or electrical properties of the interface can reduce the system performance or in severe cases, make it inoperable. There are several factors which can inhibit the performance of the interconnect, one of most severe is long term exposure to elevated temperatures. This effect can also be accelerated when combined with other severe environmental conditions such as high vibration and physical shock, which are often found in down hole oil and gas well drilling applications. This type of exposure can significantly degrade the essential properties of a reliable electrical interface such as contact resistance, mechanical stability, and electrical isolation. This paper will present options for design features and material properties that can be incorporated into an interconnect design that will mitigate these adverse effects. Specifically, this paper addresses the material properties of the contact interface and its surface treatment, the mechanical and electrical properties of the insulating material, the robustness of the mating features and the contact retention system. Two key features of the contact interface that are discussed are the stability of its electrical resistance and the robustness of its mechanical retention. Long term exposure to high temperatures typically induces stress relaxation in the compliant members of the contact interface that are required to produce a stable, low resistance interface, while allowing for a high level of mate / unmate durability. Stress relaxation can also reduce the mechanical stability of the contact interface where metal or plastic retention features are utilized. In the case of retention through epoxy bonding, imparting thermal stress at the bonding surface can result in loss of adhesion and / or retention. The surface treatment of the contact interface has also been shown to be a contributing factor in its electrical stability in high temperature applications. Typically, the interface is plated with a hard gold over nickel finish, which provides a noble interface that is corrosion resistant, but with the hardness required to withstand many mate / unmate cycles. A small percentage of nickel or cobalt are typically alloyed with the gold to produce the required hardness. In most applications, it has minimal impact on the overall resistance of the contact interface. In high temperature applications, however, it can tend to diffuse through the gold to the contact interface. Since these materials have a higher resistivity, they can negatively affect the resistance of the interface. The impact of this effect is reviewed in this paper. Finally, results of the evaluations on high temperature insulating materials and bonding epoxies are presented in this paper. The mechanical and dielectric stability of the insulating materials and the adhesion properties of the epoxy used for contact retention were the primary concerns for their evaluation. The verification tests that included at temperature exposure were conducted at +260°C to simulate extreme use cases for most down hole applications.


1997 ◽  
Vol 3 (S2) ◽  
pp. 399-400
Author(s):  
Y.C. Lu ◽  
H. Kung ◽  
J-P Hirvonen ◽  
T.R. Jervis ◽  
M. Nastasi ◽  
...  

Thin film multilayers have been the focus of extensive studies recently due to the interesting properties they exhibit. Since the improvement in properties can be attributed directly to the unique nanoscale microstructures, it is essential to understand the factors affecting the microstructural stability in these nanolayer structures. The intermetallic compound, MoSi2, despite its superior oxidation resistance and high melting point, suffers from inadequate high temperature strength and low temperature ductility, properties which hinder its high temperature structural applications [1]. SiC is a potential second phase reinforcement due to its high temperature strength and thermal compatibility with MoSi2. The addition of SiC in a nanolayered configuration has been shown to exhibit significant increase in hardness after annealing [2]. It has also been shown that when annealed above 900°C, the layers break down and grain growth sets in, with a significant decrease in hardness and. Due to the lack of a thermochemical driving force, the two phases remain separate at all temperatures investigated. In this study, the stability of the MoSi2/SiC nanolayers structure under ion irradiation has been investigated.


2014 ◽  
Vol 598 ◽  
pp. 8-12
Author(s):  
K.R. Phaneesh ◽  
Anirudh Bhat ◽  
Gautam Mukherjee ◽  
Kishore T. Kashyap

Large scale Potts model Monte Carlo simulation was carried on 3-dimensional square lattices of 1003 and 2003 sizes using the Metropolis algorithm to study grain growth behavior. Simulations were carried out to investigate both growth kinetics as well as the Zener limit in two-phase polycrystals inhibited in growth by second phase particles of single-voxel size. Initially the matrices were run to 10,000 Monte Carlo steps (MCS) to check the growth kinetics in both single phase and two-phase poly-crystals. Grain growth exponent values obtained as a result have shown to be highest (~ 0.4) for mono-phase materials while the value decreases with addition of second phase particles. Subsequently the matrices were run to stagnation in the presence of second phase particles of volume fractions ranging from 0.001to 0.1. Results obtained have shown a cube root dependence of the limiting grain size over the particle volume fraction thus reinforcing earlier 3D simulation efforts. It was observed that there was not much difference in the values of either growth kinetics or the Zener limit between 1003 and 2003 sized matrices, although the results improved mildly with size.


Author(s):  
Koji Sato ◽  
Shinya Kurokawa ◽  
Toshiyuki Sawa

Bolted flange connections with gaskets have been used under high temperature and long-term conditions. Sometimes leakage accidents occur from the gasket interfaces due to the creep and relaxation phenomena. In the present paper, the changes of the gasket stress in bolted flange connections under high temperature conditions for a long-term are analyzed using FEM calculations taking into account the gasket temperature dependency. The gaskets used are PTFE-blended (V#GF300). It’s shown that the effect of the temperature on the stress-strain relationship of the gasket is substantial. The changes in the gasket stress of the connections for 12 months are analyzed using the FEM. The effects of nominal diameter of flanges, retightening and the fluid temperature (20 to 300 °C) on the change of gasket stress in the connections under elevated temperature are examined using the FEM calculations. It is found that the reduction in the gasket stress is over 40%. In addition, experiments to measure the axial bolt force were carried out. The calculated results are in a fairly good agreement with the experimental results. The results reveal that the long-term behavior of the bolted flange connections can be estimated in our study. Discussion is made on the effects of the bolt preload and retightening on the reduction of the gasket stress and the sealing performance.


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