Thermal analysis of GaN-based laser diode mini-array

2018 ◽  
Vol 27 (9) ◽  
pp. 094208
Author(s):  
Jun-Jie Hu ◽  
Shu-Ming Zhang ◽  
De-Yao Li ◽  
Feng Zhang ◽  
Mei-Xin Feng ◽  
...  
Keyword(s):  
2016 ◽  
Vol 37 (1) ◽  
pp. 81-87
Author(s):  
井红旗 JING Hong-qi ◽  
仲莉 ZHONG Li ◽  
倪羽茜 NI Yu-xi ◽  
张俊杰 ZHANG Jun-jie ◽  
刘素平 LIU Su-ping ◽  
...  

Author(s):  
Graham Kryger ◽  
Anika McCarter

The focus of this student project was to design and develop a laser diode opto-mechanical package for nLight Photonics Company. This design process involved examining the existing models of the package design and assessing the manufacturing process. Limitations regarding tooling, alignment, and package materials were also taken into account. The package was modeled in SolidWorks, considering these limiting parameters and changing the size and shape of the package from previous models in order to increase spatial efficiency. Analysis of the package was performed to ensure heat would dissipate properly from the diode, and that the diode would operate within the specified temperature range. The thermal analysis was performed using various methods, including a simple spreadsheet analysis and specialized software. This paper will examine each of these design processes in more detail.


2006 ◽  
Vol 2 (4) ◽  
pp. 273-277 ◽  
Author(s):  
Ming-wei Yang ◽  
Wen-hai Xu ◽  
Wen-yan Tang

2018 ◽  
Vol 08 (03) ◽  
pp. 40-49
Author(s):  
Ada Czesnakowska ◽  
Gerald Ledru ◽  
Benoit Glorieux ◽  
Georges Zissis

2010 ◽  
Vol 30 (4) ◽  
pp. 1055-1060
Author(s):  
胡黎明 Hu Liming ◽  
李再金 Li Zaijin ◽  
秦莉 Qin Li ◽  
杨晔 Yang Ye ◽  
王烨 Wang Ye ◽  
...  

2011 ◽  
Vol 50 (9S1) ◽  
pp. 09MA05 ◽  
Author(s):  
Baoxi Xu ◽  
Cheow Wee Chia ◽  
Qide Zhang ◽  
Yeow Teck Toh ◽  
Chengwu An ◽  
...  

2010 ◽  
Vol E93-C (10) ◽  
pp. 1499-1503 ◽  
Author(s):  
Katsuya SHIRAI ◽  
Takashi NOGUCHI ◽  
Yoshiaki OGINO ◽  
Eiji SAHOTA
Keyword(s):  

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