Development of improved technology of production of sewing products using equipment for moisture-heat treatment from a composite material

The article covers the conditions of formation of package materials for outerwear. The developed new technology for the production of apparels using a new cushion of press equipment for moisture-heat treatment from a composite material has been described. The method of forming a package of clothes from a multilayer textile material has been substantiated. The results of the examination of the experimental wear of jackets made according to the existing and proposed technology are presented in order to conduct a comparative study of the appearance, comfort and wear resistance of products made under identical conditions. Because of theoretical and practical research, the required dimensional stability of outerwear parts has been achieved in the process of the new technology of moisture-heat treatment.

Effects of Porosity on the Static Compression of Foam Buffer Materials of Plant Fiber and Their Numerical Model

In recent years, researchers have investigated plant fiber foam buffer package materials for their environmental advantages, which include their ability to completely biodegrade and their rich raw materials. The porosity of buffer materials is an important factor that affects a plant’s static compression property. In this study, foam buffer package materials of plant fiber were developed using bleached bagasse pulp as the main raw material. A digital microscope was used to observe the porosity structures of the foam buffer materials, and the porosity was calculated via binary image processing using Matlab software. The effects of porosity on the static compression properties of cushion materials were discussed, and a numerical model was established. The results indicated that the threshold value chosen affected the calculation of the porosities of buffer materials, which in turn have significant effects on their specific static compression properties. The variation trend of the stress-strain curve fits the hyperbolic tangent function, according to which a numerical model was established. The results of this experiment were in accordance with the theoretical values, which will support the theoretical design of foam buffer package materials of plant fiber.

Kinetic Studies on Radical Scavenging Activity of Kaempferol Decreased by Sn(II) Binding

Sn(II) binds to kaempferol (HKaem, 3,4′,5,7-tetrahydroxy-2-(4-hydroxyphenyl)-4H-1-benzopyran-4-one) at the 3,4-site forming [Sn(II)(Kaem)2] complex in ethanol. DPPH• scavenging efficiency of HKaem is dramatically decreased by SnCl2 coordination due to formation of acid inhibiting deprotonation of HKaem as ligands and thus reduces the radical scavenging activity of the complex via a sequential proton-loss electron transfer (SPLET) mechanism. Moderate decreases in the radical scavenging of HKaem are observed by Sn(CH3COO)2 coordination and by contact between Sn and HKaem, in agreement with the increase in the oxidation potential of the complex compared to HKaem, leading to a decrease in antioxidant efficiency for fruits and vegetables with Sn as package materials.

Training for Workers and Safety Representatives on Manufactured Nanomaterials

Although nanotechnologies are increasingly present in numerous sectors of the economy, training resources available to workers exposed to them are still rare. In the European Union (EU), some initiatives exist that inform workers about exposure and risks, but they lack two key dimensions: the involvement of workers themselves in designing and implementing training materials and the key role played by safety representatives in improving occupational health and safety in EU member states. Making workers actors of their own training, rather than recipients of it, and empowering them, so that they can collectively question unsafe situations and ask for changes in their working conditions, is how training can positively impact their health and safety. This article describes a training package (materials, infographics, interactive web applet) designed specifically to achieve this objective. Developed under the NanoDiode project, it focuses on six key themes: types of nanomaterials, uses at work, risks, presence in the workplace, exposure, and experience sharing.

Effects of Y2O3-LaF3on the low temperature sintering and thermal conductivity of AlN ceramics

PurposeAluminum nitride (AlN) ceramics are suitable substrate and package materials for high-power integrated circuits.Design/methodology/approachDense AlN ceramics with Y2O3and LaF3as sintering additives are prepared. The effects of these additives on the density, phase composition, microstructure and thermal conductivity of AlN ceramics are investigated.FindingsResults show that 2 Wt.% Y2O3-doped additive is insufficient for the samples to achieve the full densification sintered at 1,700°C. When LaF3is added with Y2O3, the samples are perfectly densified at the same sintering condition. The relative density and thermal conductivity of the samples are 97.8-99.07 per cent and 169.104-200.010 W·m-1·K-1, respectively. The density of the samples and their microstructure, especially the content and distribution of secondary phases, is necessary to control the thermal conductivity of AlN ceramics.Originality/valueY2O3and LaF3additives can effectively promote densification and enhance the thermal conductivity of AlN ceramics in a low sintering temperature, and the AlN ceramics added with Y2O3-LaF3might have potential applications in package materials for high-power integrated circuits.

Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus Environment

This paper presents experimental results of a prototype high temperature co-fired ceramic (HTCC) package with Au/Pt metallization in a three-phase harsh environment test that culminated with 60-day demonstration in simulated Venus surface environment of 465 °C with corrosive atmosphere at 90 bar pressure. The prototype package is based on previously developed and reported HTCC package successfully tested with multiple analog and digital silicon carbide (SiC) high temperatures semiconductor integrated circuits (ICs) at NASA Glenn Research Center in 500 °C Earth air ambient for over ten thousands hours, and short-term tested at temperatures above 800 °C. The three-phase harsh environment test started with 48 hours in 465 °C Earth air, followed by 48 hours in 465 °C nitrogen at 90 bar pressure and 1400 hours in simulated Venus surface environment of 465 °C with corrosive atmosphere at 90 bar. Initial analytical results of the package materials and surfaces after exposure to Venus environment are discussed to assess the stability of the packaging materials in the tested environments. The test in simulated Venus environment was implemented in the NASA Glenn Extreme Environment Rig (GEER). The results of this study suggest that an effective encapsulation of areas of surface metallization and vicinities may help to improve electrical performance of a HTCC alumina packaging system in Venus environment.