Thin-Film π-Type Micro TEG Using Vacuum/Insulator-Hybrid Isolation with Convex-Shape Hot-Plate Module Structure for Wearable Device Applications
2019 ◽
Vol 1407
◽
pp. 012099
◽
Keyword(s):
Keyword(s):
Keyword(s):
2017 ◽
Vol 157
◽
pp. 1801-1808
◽
Keyword(s):