Numerical analysis of micro-channel heat sink using ethylene glycol based nanofluid in case of electronics cooling

Micro-channels embedded in solid matrix have already proven to be a very efficient way of electronics cooling. Traditional micro-channel heat sinks consist of single layer of parallel channels. Although micro-channel heat sink can achieve very high heat flux, its pumping requirement for circulating liquid through the channel increases very sharply as the flow velocity increases. The pumping requirement can be reduced by stacking multi layers of micro-channels. By introducing multi layers of channels, the flow velocity through each channel is reduced for the same total mass flow rate of the coolant. A novel approach to take advantage of multi layered channel is proposed in this study where the vertical channels are interconnected to allow cross flow of the coolant. The cross-flow between the channels disrupts boundary layer enhancing heat removal capacity of the heat sink. A CFD model has been developed using commercially available software package FLUENT to evaluate overall thermal performance of multi layered micro-channel heat sink. A parametric study of the flow rates and the effect of the number of layers and interconnections have been performed. Significant reduction in thermal resistance has been observed for multiple layers, it is also observed that this reduction in thermal resistance is dependent on the thermal conductivity of the heat sink material.

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Numerical Analysis of Inclined Jet Micro-channel Heat Sink Using Nanofluids

Lecture Notes in Mechanical Engineering - Recent Advances in Mechanical Engineering ◽

10.1007/978-981-15-9678-0_71 ◽

2021 ◽

pp. 851-860

Author(s):

Mohammad Zunaid ◽

Prakash Singh ◽

Afzal Husain

Keyword(s):

Numerical Analysis ◽

Heat Sink ◽

Micro Channel

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A Honeycomb Micro Channel Cooling System for Electronics Cooling

ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels ◽

10.1115/icnmm2009-82058 ◽

2009 ◽

Author(s):

Xiaobing Luo ◽

Yonglu Liu ◽

Wei Liu

Keyword(s):

Heat Sink ◽

Room Temperature ◽

Single Phase ◽

Cooling System ◽

Electronics Cooling ◽

Test System ◽

Experimental Results ◽

Micro Channel ◽

Pumping Power ◽

Single Phase Flow

A honeycomb porous micro channel cooling system for cooling of electronic chips is proposed in this paper. The design, fabrication, test system configuration of the micro channel heat sink is summarized. Preliminary experimental investigation is conducted to determine the heat transfer characteristics and cooling performance under steady single-phase flow of water liquid. In the experiments, the brass micro channel heat sink is attached to a test heater with 8cm2 area, the experimental results show that the cooling system can effectively remove the heat flux of 18.2W/cm2 under 2.4W pumping power, while the junction-wall temperature is 48.3°C at the room temperature of 26°C. The experimental results show that the present cooling system has good performance.

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