All-Wet Metallization Process for Transparent Polyimide Films

AbstractThe synthesis of reflective silvered polyimide films by a single-stage auto-metallization process entailing the (hexafluoroacetylacetonato)silver(I) complex dissolved in solutions of poly(amic acid)s and polyimides formed from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropanedianhydride (6FDA) and 2,2-bis(4-(4-aminophenoxy)hexafluoropropane (4-BDAF) is described. Heating cast silver(I)-poly(amic acid)/polyimide films effects silver(I) reduction and nanoaggregation giving reflective films for Ag concentrations from 6-10 wt %. A6% silver film gives specular reflectivies greater than 80%. Films prepared from the soluble fully imidized form of 6FDA/4-BDAF were less reflective.

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Electron microscopy and diffraction studies of polyimides

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100074069 ◽

1983 ◽

Vol 41 ◽

pp. 28-29

Author(s):

O.C. de Hodgins ◽

K. R. Lawless ◽

R. Anderson

Keyword(s):

Electron Microscopy ◽

Electron Microscope ◽

Structural Features ◽

Inert Atmosphere ◽

Polyimide Films ◽

Resolution Electron ◽

The Matrix ◽

High Resolution Electron Microscope ◽

Diffraction Patterns ◽

Polymeric Samples

Commercial polyimide films have shown to be homogeneous on a scale of 5 to 200 nm. The observation of Skybond (SKB) 705 and PI5878 was carried out by using a Philips 400, 120 KeV STEM. The objective was to elucidate the structural features of the polymeric samples. The specimens were spun and cured at stepped temperatures in an inert atmosphere and cooled slowly for eight hours. TEM micrographs showed heterogeneities (or nodular structures) generally on a scale of 100 nm for PI5878 and approximately 40 nm for SKB 705, present in large volume fractions of both specimens. See Figures 1 and 2. It is possible that the nodulus observed may be associated with surface effects and the structure of the polymers be regarded as random amorphous arrays. Diffraction patterns of the matrix and the nodular areas showed different amorphous ring patterns in both materials. The specimens were viewed in both bright and dark fields using a high resolution electron microscope which provided magnifications of 100,000X or more on the photographic plates if desired.

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Characterization of Unfilled Tungsten Plugs on a 0.35μm CMOS Multilevel Metallization Process

ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa1996p0141 ◽

1996 ◽

Author(s):

H. Sur ◽

S. Bothra ◽

Y. Strunk ◽

J. Hahn

Keyword(s):

Process Development ◽

Process Integration ◽

Wafer Level ◽

Electrical Failure ◽

Analysis Techniques ◽

Integration Approach ◽

Intermetal Dielectric ◽

Metallization Process ◽

Section Analysis

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.

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Polar Anchoring Properties of Photoalignment Polyimide Films

Proceedings of the International Display Workshops ◽

10.36463/idw.2019.0324 ◽

2019 ◽

pp. 324

Author(s):

Wei-Wei Chen ◽

Jui-Wen Pan ◽

Shie-Chang Jeng

Keyword(s):

Polyimide Films

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Influence of Nanosized Cerium Oxide on the Thermal Characteristics of Aromatic Polyimide Films

Polymer Science Series C ◽

10.1134/s181123822002006x ◽

2020 ◽

Vol 62 (2) ◽

pp. 196-204

Author(s):

I. V. Gofman ◽

A. L. Nikolaeva ◽

I. V. Abalov ◽

E. M. Ivan’kova ◽

I. V. Kuntzman ◽

...

Keyword(s):

Cerium Oxide ◽

Thermal Characteristics ◽

Polyimide Films ◽

Aromatic Polyimide

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Influence of manufacturing techniques R-BAPB polyimide films on charge relaxation

10.1063/5.0033343 ◽

2020 ◽

Author(s):

Almaz Kamalov ◽

Margarita Borisova ◽

Andrey Didenko ◽

Gleb Vaganov ◽

Vladimir Yudin

Keyword(s):

Polyimide Films ◽

Charge Relaxation ◽

Manufacturing Techniques

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An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽

10.3390/polym13121955 ◽

2021 ◽

Vol 13 (12) ◽

pp. 1955

Author(s):

Marco Cen-Puc ◽

Andreas Schander ◽

Minerva G. Vargas Gleason ◽

Walter Lang

Keyword(s):

Flexible Electronics ◽

Oxygen Plasma ◽

Reactive Ion Etching ◽

Peel Test ◽

Scratch Test ◽

Peel Strength ◽

Surface Treatments ◽

Oxygen Plasma Treatment ◽

Polyimide Films ◽

Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

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