Lotus-on-chip: computer-aided design and 3D direct laser writing of bioinspired surfaces for controlling the wettability of materials and devices

<div>State-of-the-art Heterogeneous System on Chips (HMPSoCs) can perform on-chip embedded inference on its CPU and GPU. Multi-component pipelining is the method of choice to provide high-throughput Convolutions Neural Network (CNN) inference on embedded platforms. In this work, we provide details for the first CPU-GPU pipeline design for CNN inference called Pipe-All. Pipe-All uses the ARM-CL library to integrate an ARM big.Little CPU with an ARM Mali GPU. Pipe-All is the first three-stage CNN inference pipeline design with ARM’s big CPU cluster, Little CPU cluster, and Mali GPU as its stages. Pipe-All provides on average 75.88% improvement in inference throughput (over peak single-component inference) on Amlogic A311D HMPSoC in Khadas Vim 3 embedded platform. We also provide an open-source implementation for Pipe-All.</div><div>This paper is submitted to IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) as a transaction brief paper (5 pages).</div>

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3D computer-aided nanoprinting for solid-state nanopores

Nanoscale Horizons ◽

10.1039/c8nh00006a ◽

2018 ◽

Vol 3 (3) ◽

pp. 312-316 ◽

Cited By ~ 4

Author(s):

Haibo Ding ◽

Qiming Zhang ◽

Zhongze Gu ◽

Min Gu

Keyword(s):

Solid State ◽

Polymerization Process ◽

Direct Laser Writing ◽

Laser Writing ◽

Two Photon ◽

Direct Laser ◽

Computer Aided ◽

Two Photon Polymerization

Solid-state nanopores with controllable sizes and shapes were generated by direct laser writing using a computer-aided two-photon polymerization process.

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Hierarchically Porous, Laser-Pyrolyzed Carbon Electrode from Black Photoresist for On-Chip Microsupercapacitors

Nanomaterials ◽

10.3390/nano11112828 ◽

2021 ◽

Vol 11 (11) ◽

pp. 2828

Author(s):

Soongeun Kwon ◽

Hak-Jong Choi ◽

Hyung Cheoul Shim ◽

Yeoheung Yoon ◽

Junhyoung Ahn ◽

...

Keyword(s):

High Performance ◽

Thermal Reaction ◽

Graphitic Carbon ◽

Direct Laser Writing ◽

Laser Writing ◽

Experimental Conditions ◽

Laser Pyrolysis ◽

Direct Laser ◽

On Chip ◽

Carbon Dioxide Co2

We report a laser-pyrolyzed carbon (LPC) electrode prepared from a black photoresist for an on-chip microsupercapacitor (MSC). An interdigitated LPC electrode was fabricated by direct laser writing using a high-power carbon dioxide (CO2) laser to simultaneously carbonize and pattern a spin-coated black SU-8 film. Due to the high absorption of carbon blacks in black SU-8, the laser-irradiated SU-8 surface was directly exfoliated and carbonized by a fast photo-thermal reaction. Facile laser pyrolysis of black SU-8 provides a hierarchically macroporous, graphitic carbon structure with fewer defects (ID/IG = 0.19). The experimental conditions of CO2 direct laser writing were optimized to fabricate high-quality LPCs for MSC electrodes with low sheet resistance and good porosity. A typical MSC based on an LPC electrode showed a large areal capacitance of 1.26 mF cm−2 at a scan rate of 5 mV/s, outperforming most MSCs based on thermally pyrolyzed carbon. In addition, the results revealed that the high-resolution electrode pattern in the same footprint as that of the LPC-MSCs significantly affected the rate performance of the MSCs. Consequently, the proposed laser pyrolysis technique using black SU-8 provided simple and facile fabrication of porous, graphitic carbon electrodes for high-performance on-chip MSCs without high-temperature thermal pyrolysis.

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On-chip Direct Laser Writing of PAN-based Carbon Supercapacitor Electrodes

10.33774/chemrxiv-2021-z4811 ◽

2021 ◽

Author(s):

Andreas Hoffmann ◽

Pablo Jiménez-Calvo ◽

Volker Strauss ◽

Alexander Kühne

Keyword(s):

Laser Power ◽

Printed Circuit Board ◽

Circuit Board ◽

Carbon Electrodes ◽

Direct Laser Writing ◽

Laser Writing ◽

Printed Circuit ◽

Direct Laser ◽

On Chip

We report carbonization of polyacrylonitrile by direct laser writing to produce microsupercapacitors directly on-chip. We demonstrate the process by producing interdigitated carbon finger electrodes directly on a printed circuit board, which we then employ to characterize our supercapacitor electrodes. By varying the laser power, we are able to tune the process from carbonization to material ablation. This allows to not only convert pristine polyacrylonitrile films into carbon electrodes, but also to pattern and cut away non-carbonized material to produce completely freestanding carbon electrodes. While the carbon electrodes adhere well to the printed circuit board, non-carbonized polyacrylonitrile is peeled off the substrate. We achieve specific capacities as high as 260 µF/cm2 in a supercapacitor with 16 fingers.

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Evaluation of marginal/internal fit of chrome-cobalt crowns: Direct laser metal sintering versus computer-aided design and computer-aided manufacturing

Nigerian Journal of Clinical Practice ◽

10.4103/1119-3077.188699 ◽

2016 ◽

Vol 19 (5) ◽

pp. 636 ◽

Cited By ~ 9

Author(s):

S Gunsoy ◽

M Ulusoy

Keyword(s):

Computer Aided Design ◽

Computer Aided Manufacturing ◽

Direct Laser ◽

Computer Aided ◽

Aided Design ◽

Internal Fit ◽

Metal Sintering

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Functional Metallic Microcomponents via Liquid-Phase Multiphoton Direct Laser Writing: A Review

Micromachines ◽

10.3390/mi10120827 ◽

2019 ◽

Vol 10 (12) ◽

pp. 827 ◽

Cited By ~ 2

Author(s):

Erik Hagen Waller ◽

Stefan Dix ◽

Jonas Gutsche ◽

Artur Widera ◽

Georg von Freymann

Keyword(s):

Liquid Phase ◽

Microelectromechanical Systems ◽

Direct Laser Writing ◽

Laser Writing ◽

Metal Structures ◽

Direct Laser ◽

Chip Fabrication ◽

Direct Laser Fabrication ◽

On Chip ◽

Metallic Microstructures

We present an overview of functional metallic microstructures fabricated via direct laser writing out of the liquid phase. Metallic microstructures often are key components in diverse applications such as, e.g., microelectromechanical systems (MEMS). Since the metallic component’s functionality mostly depends on other components, a technology that enables on-chip fabrication of these metal structures is highly desirable. Direct laser writing via multiphoton absorption is such a fabrication method. In the past, it has mostly been used to fabricate multidimensional polymeric structures. However, during the last few years different groups have put effort into the development of novel photosensitive materials that enable fabrication of metallic—especially gold and silver—microstructures. The results of these efforts are summarized in this review and show that direct laser fabrication of metallic microstructures has reached the level of applicability.

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Mask Design and Simulation: Computer Aided Design for Lab-on-Chip Application

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.832.84 ◽

2013 ◽

Vol 832 ◽

pp. 84-88

Author(s):

Veeradasan Perumal ◽

U. Hashim ◽

Tijjani Adam

Keyword(s):

Computer Aided Design ◽

Biomedical Application ◽

Microfluidic Channel ◽

Research Attention ◽

Lab On Chip ◽

Mask Design ◽

Computer Aided ◽

On Chip ◽

Aided Design ◽

Mask Fabrication

A simple design and simulation of microwire, contact pad and microfluidic channel on computer aided design (CAD) for chrome mask fabrication are described.The integration of microfluidic and nanotechnology for miniaturized lab-on-chip device has received a large research attention due to its undisputable and widespread biomedical applications. For the development of a micro-total analytical system, the integration of an appropriate fluid delivery system to a biosensing apparatus is required. In this study, we had presented the new Lab-On-Chip design for biomedical application. AutoCAD software was used to present the initial design/prototype of this Lab-On-Chip device. The microfluidic is design in such a way, that fluid flow was passively driven by capillary effect. Eventually, the prototype of the microfluidics was simulated using Comsol Multiphysics software for design validation.The complete design upon simulation is then used for mask fabrication. Hence, three mask is fabricated which consist of microwire, contact pad and microfluidics for device fabrication using photolithography process.

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