scholarly journals Thermal stress analysis of disc brake using analytical and numerical methods

2021 ◽  
Vol 1201 (1) ◽  
pp. 012033
Author(s):  
I T Jiregna ◽  
H G Lemu
Keyword(s):  
Thermal Stress ◽  
High Temperature ◽  
Temperature Distribution ◽  
Stress Analysis ◽  
Coupled Analysis ◽  
Brake Disc ◽  
Disc Brake ◽  
Thermal Stress Analysis ◽  
Stress Development ◽  
Solution Approach

Abstract This article presents study of the thermal stress development in brake disc and the associated life cycle of the disc. The thermal stress analysis of disc brake under the first brake application and the influences of thermal loads on stress development of the disc have been investigated. The temperature distribution was conducted as a function of disc thickness and braking time. The study was done on the disc brake of Sports Utility Vehicle with a model of DD6470C. Partial solution approach was used to solve analytical temperature distribution through the thickness. The model was done using representative areas of the disc exposed to high temperature whose distribution result was obtained as a function of disc thickness and braking time. The solutions of coupled thermal transient fields and stress fields were obtained based on thermal-structural coupled analysis. Based on the model developed for the study, the positions of high and low stress formations were investigated, and it has been observed that thermal stress and temperature gradient show similar behavior through the thickness of disc. Generally, high temperature and stress components were found on the rubbing surfaces of the disc.

scholarly journals Modeling of Thermal and Mechanical Behavior of ZrB2-SiC Ceramics after High Temperature Oxidation

2014 ◽  
Vol 2014 ◽  
pp. 1-9 ◽  
Author(s):  
Jun Wei ◽  
Lokeswarappa R. Dharani ◽  
K. Chandrashekhara ◽  
Gregory E. Hilmas ◽  
William G. Fahrenholtz
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Thermal Stress ◽  
High Temperature ◽  
Mechanical Behavior ◽  
Stress Analysis ◽  
Heat Transfer Analysis ◽  
Temperature Oxidation ◽  
Thermal Stress Analysis ◽  
Sic Ceramics

The effects of oxidation on heat transfer and mechanical behavior of ZrB2-SiC ceramics at high temperature are modeled using a micromechanics based finite element model. The model recognizes that when exposed to high temperature in air ZrB2-SiC oxidizes into ZrO2, SiO2, and SiC-depleted ZrB2 layer. A steady-state heat transfer analysis was conducted at first and that is followed by a thermal stress analysis. A “global-local modeling” technique is used combining finite element with infinite element for thermal stress analysis. A theoretical formulation is developed for calculating the thermal conductivity of liquid phase SiO2. All other temperature dependent thermal and mechanical properties were obtained from published literature. Thermal stress concentrations occur near the pore due to the geometric discontinuity and material properties mismatch between the ceramic matrix and the new products. The predicted results indicate the development of thermal stresses in the SiO2 and ZrO2 layers and high residual stresses in the SiC-depleted ZrB2 layer.

Thermodynamics Coupling Analysis of Grid-Controlled Electron Gun

2013 ◽  
Vol 423-426 ◽  
pp. 1433-1437 ◽  
Author(s):  
Fang Fang Song ◽  
Sha Xu ◽  
Yun Fei En
Keyword(s):  
Thermal Stress ◽  
High Temperature ◽  
Stress Analysis ◽  
Thermal Deformation ◽  
Electron Gun ◽  
Design Parameters ◽  
Axial Distance ◽  
Thermal Stress Analysis ◽  
Steady State Temperature ◽  
Cathode Temperature

This paper carried out temperature analysis in the working state of the electron gun structure, the thermal deformation under high temperature and thermal stress analysis. Firstly, from the steady state temperature cloud chart of the electron gun we can see the cathode temperature is 985 °C, shadow grid temperature is same as cathode temperature, and the controlled-grid temperature is as high as 540 °C. Secondly, on the basis of thermal analysis, the coupled thermo-mechanical simulation technology is broken through; further thermal stress and thermal deformation at high temperature are analyzed. Thermal stress analysis results show that the maximum stress point is at contact area of cathode and its supporting tube. And the thermal deformation result shows that at high temperature under the action of thermal deformation, the axial distance of cathode-grid distance reduced 0.078 mm. Based on thermal deformation, the development personnel of microwave tube can use simulator to analysis the influence of thermal deformation to the electron gun design parameters, which can provide theoretical basis for tube design.

Plane Thermal Stress Analysis of an Orthotropic Cylinder Subjected to an Arbitrary, Transient, Asymmetric Temperature Distribution

2002 ◽  
Vol 69 (5) ◽  
pp. 632-640 ◽  
Author(s):  
K.-C. Yee ◽  
T. J. Moon
Keyword(s):  
Temperature Field ◽  
Thermal Stress ◽  
Temperature Distribution ◽  
Analytical Solution ◽  
Stress Analysis ◽  
Stress Function ◽  
Thermal Stresses ◽  
Shear Stresses ◽  
Thermal Stress Analysis ◽  
Interlaminar Shear

A closed-form, analytical solution is presented for the transient, plane thermal stress analysis of a linearly elastic, homogeneously orthotropic hollow cylinder subjected to an arbitrary temperature distribution. The thermoelastic solution, obtained by a stress function approach, can be used as the basis for the corresponding thermoviscoelastic solution for thermorheologically simple viscoelastic materials by invoking the viscoelastic Correspondence Principle. This solution can also be directly extended to the class of weakly inhomogeneously orthotropic cylinders using perturbation methods. The transient asymmetric temperature field is characterized by Fourier-Bessel eigenfunction expansions. The analytically derived stress function satisfies a linear, fourth-order inhomogeneous partial differential equation and the Cesaro integral conditions, which assure the existence of a single-valued displacement field. The corresponding thermal stresses are then computed by the stress-stress function relations. A key feature of the analytical solution is that the hoop, radial, and shear stresses, due to the transient arbitrary temperature distribution, are expressed explicitly in terms of the scalar temperature field. A polymer composite example is presented to validate the current method and to qualitatively illustrate the distribution of thermal stresses due to an asymmetric temperature distribution. Numerical results are presented for the thermally driven hoop, radial and (interlaminar) shear stresses in a hollow, hoop-wound glass/epoxy cylinder. This analysis demonstrates that potentially debilitating interlaminar shear stresses can develop in laminated composites when subjected to an even modest transient asymmetric temperature distribution. Their magnitudes depend on the severity of the spatial and temporal thermal gradients in the circumferential direction. While still relatively low compared to the hoop stress, the shear stress may cause thermal failure due to the typically low interlaminar shear strengths of laminated composite materials.

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