Damage Behavior Evaluation and Thermal Stress Analysis with coupled analysis of Carbon Fiver Reinforced Polycyanate Esters under Thermal Cyclic Environment

2016 ◽  
Vol 2016.24 (0) ◽  
pp. 120
Author(s):  
Tomoaki SHIMPO ◽  
Satoshi KOBAYASHI ◽  
Ken GOTO ◽  
Minoru IWATA
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Coupled Analysis ◽  
Damage Behavior ◽  
Thermal Stress Analysis

scholarly journals Thermal stress analysis of disc brake using analytical and numerical methods

2021 ◽  
Vol 1201 (1) ◽  
pp. 012033
Author(s):  
I T Jiregna ◽  
H G Lemu
Keyword(s):  
Thermal Stress ◽  
High Temperature ◽  
Temperature Distribution ◽  
Stress Analysis ◽  
Coupled Analysis ◽  
Brake Disc ◽  
Disc Brake ◽  
Thermal Stress Analysis ◽  
Stress Development ◽  
Solution Approach

Abstract This article presents study of the thermal stress development in brake disc and the associated life cycle of the disc. The thermal stress analysis of disc brake under the first brake application and the influences of thermal loads on stress development of the disc have been investigated. The temperature distribution was conducted as a function of disc thickness and braking time. The study was done on the disc brake of Sports Utility Vehicle with a model of DD6470C. Partial solution approach was used to solve analytical temperature distribution through the thickness. The model was done using representative areas of the disc exposed to high temperature whose distribution result was obtained as a function of disc thickness and braking time. The solutions of coupled thermal transient fields and stress fields were obtained based on thermal-structural coupled analysis. Based on the model developed for the study, the positions of high and low stress formations were investigated, and it has been observed that thermal stress and temperature gradient show similar behavior through the thickness of disc. Generally, high temperature and stress components were found on the rubbing surfaces of the disc.

Thermal stress analysis of a directionally solidified Al–1wt%Ni alloy casting

2010 ◽  
Vol 46 (10) ◽  
pp. 889-895 ◽  
Author(s):  
Moisés M. Pariona ◽  
Josuel K. Rugenski ◽  
Manuel V. Canté ◽  
José E. Spinelli ◽  
Amauri Garcia
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Directionally Solidified ◽  
Thermal Stress Analysis ◽  
Alloy Casting ◽  
Ni Alloy

Thermal stress analysis of a multichip package design

1989 ◽  
Vol 12 (4) ◽  
pp. 663-672 ◽  
Author(s):  
R. Darveaux ◽  
I. Turlik ◽  
L.-T. Hwang ◽  
A. Reisman
Keyword(s):  
Thermal Stress ◽  
Stress Analysis ◽  
Package Design ◽  
Thermal Stress Analysis
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