scholarly journals Study on mat-surface fabrication utilizing fixed-abrasive tool (Application to brittle material)

2019 ◽  
Vol 501 ◽  
pp. 012029
Author(s):  
K Yanagihara ◽  
R Kita
Keyword(s):  
Brittle Material ◽  
Abrasive Tool ◽  
Surface Fabrication ◽  
Fixed Abrasive

Subsurface damage prediction for optical Hard-brittle material in fixed abrasive lapping

2017 ◽  
Vol 25 (2) ◽  
pp. 367-374 ◽  
Author(s):  
朱永伟 ZHU Yong-wei ◽  
李信路 LI Xin-lu ◽  
王占奎 WANG Zhan-kui ◽  
凌顺志 LING Shun-zhi
Keyword(s):  
Brittle Material ◽  
Subsurface Damage ◽  
Damage Prediction ◽  
Fixed Abrasive

CMP Using Fixed Abrasive Tool (FX-CMP) for Dielectric Planarization

2001 ◽  
Author(s):  
S. Katagiri ◽  
K. Yasui ◽  
Y. Kawamura ◽  
U. Yamaguchi ◽  
M. Nagasawa ◽  
...  
Keyword(s):  
Abrasive Tool ◽  
Fixed Abrasive

Influences of Properties of Fixed Abrasive Tool on the Lapping Process of Stainless Steel Substrate

2010 ◽  
Vol 135 ◽  
pp. 365-369
Author(s):  
Cong Rong Zhu ◽  
Bing Hai Lv ◽  
Ju Long Yuan
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Material Removal Rate ◽  
Material Removal ◽  
Stainless Steel Substrate ◽  
Removal Rate ◽  
Steel Substrate ◽  
Abrasive Tool ◽  
Bonding Material ◽  
Fixed Abrasive

To improve the machining efficiency as well as surface roughness, a series of experiments employed fixed abrasive tools are carried out for stainless steel substrate, and influences of properties of fixed abrasive tool on the lapping process are studied. It is found that the resin is the best bonding material in this study. The surface roughness under different concentration of bonding material is similar, and the material removal rate (MRR) increases as the concentration of bonding material decreases from 50% to 20%. But too little of bonding material results into low bond strength that causing low material removal rate. It is also found that higher shear strength, lower wear rate, and the shear strength of the tool with 35% bonding material is the highest. It is obvious that the surface roughness and material removal rate decline as the grit size decreases. The roughness of surface lapped with resin bonded 4000# SiC abrasive tool comes to 18nm, and the material removal rate is 0.63μm/min.

Investigation of Semi-Fixed Abrasive Plate Wear Characteristics

2010 ◽  
Vol 126-128 ◽  
pp. 1029-1033
Author(s):  
Ping Zhao ◽  
Qian Fa Deng ◽  
Bing Hai Lv ◽  
Wei Hang ◽  
Zhi Wei Wang ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Surface Defects ◽  
Abrasive Tool ◽  
Advanced Ceramics ◽  
Wear Characteristic ◽  
Wear Characteristics ◽  
Abrasive Grains ◽  
Ultra Precision ◽  
Fixed Abrasive

In order to reduce or eliminate the surface defects caused by abrasive grains and improve the efficiency of ultra-precision processing, the technique of semi-fixed machining has been proposed for machining advanced ceramics. A semi-fixed abrasive tool (SFAT) has been manufactured; it has performances of semi-fixed machining technique. This document demonstrates wear characteristics of SFAT through experiments of machining silicon wafer. It showed that wet status or dry status of SFAT has greatly influenced wear characteristics of SFAT. Wear characteristic of SFAT presented mostly blockage and little grain-off occurred in dry status; mostly grain-off and little blockage presented in wet status.

Surface Characterization of Silicon Wafers Polished by Three Different Methods

2011 ◽  
Vol 487 ◽  
pp. 233-237 ◽  
Author(s):  
Guang Qiu Hu ◽  
Jing Lu ◽  
Jian Yun Shen ◽  
Xi Peng Xu
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Surface Characterization ◽  
Sol Gel ◽  
Silicon Wafers ◽  
Abrasive Tool ◽  
Atomic Force ◽  
Polishing Pad ◽  
Fixed Abrasive ◽  
Free Abrasive

The surface roughness and surface morphology of silicon wafers polished by three different polishing methods were analyzed in this paper. A polishing pad was prepared by means of sol-gel technology as semi-fixed abrasive tool. An electroplated polishing pad was chosen as fixed abrasive tool. And a polishing cloth was chosen as free abrasive tool. The results showed that the surface of silicon wafer polished by the sol-gel polishing pad was superior to the other two. It was easy to get mirror effect with few scratches while the free abrasive and fixed abrasive got lots of scratches on 23silicon wafers. The surface roughness of silicon wafer polished by the sol-gel polishing pad reached 1.41nm measured by atomic force microscope (AFM).

scholarly journals Study on STI planarization process using fixed abrasive tool (1st Report)

2004 ◽  
Vol 70 (1) ◽  
pp. 128-132 ◽  
Author(s):  
Souichi KATAGIRI ◽  
Kan YASUI ◽  
Ui YAMAGUCHI ◽  
Yoshio KAWAMURA ◽  
Ryousei KAWAI ◽  
...  
Keyword(s):  
Abrasive Tool ◽  
Planarization Process ◽  
Fixed Abrasive
Sign in / Sign up

Export Citation Format

Share Document