scholarly journals The Study of Interfacial Reaction between SnAgCu (SAC) Lead-free Solder Alloys and Copper Substrate: A Short Review

2020 ◽  
Vol 864 ◽  
pp. 012182
Author(s):  
Chi Ying Tan ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Norainiza Saud
Keyword(s):  
Interfacial Reaction ◽  
Copper Substrate ◽  
Short Review ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate

2018 ◽  
Vol 928 ◽  
pp. 188-193
Author(s):  
Suchart Chantaramanee ◽  
Worawit Sriwittayakul ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Rich Phase ◽  
Pasty Range ◽  
Free Solder

The effects of antimony and indium addition on wettability and interfacial reaction of Sn-3.0Ag-0.5Cu lead free solder on copper substrate were investigated. The experimental results showed the melting point of solder alloy containing 0.5 wt.% In and 0.5 wt.% Sb were slightly increased about 3.66°C. The pasty range of solder alloys were increased about 6°C while the undercooling of solder alloys were decreased. The microstructures of solder alloy were contained of In and Sb consists of Ag3Sn, Cu6(Sn,In)5, SnIn, Ag3(Sn,In) and SnSb intermetallic compounds (IMCs) dispersed on Sn-rich phase. The wettability of solder alloys were improved by increasing soldering times. In addition, the thickness of intermetallic compounds (Cu6Sn5) were obviously increased with increasing soldering times.

Interfacial Reaction and Solderability of Zn20SnxCu Solder

2011 ◽  
Vol 337 ◽  
pp. 402-405
Author(s):  
Kuai Le Zhao ◽  
Yan Fu Yan ◽  
Yang Yang Sheng ◽  
Ning Du ◽  
Zhan Lei Liu
Keyword(s):  
High Temperature ◽  
Melting Point ◽  
Intermetallic Compound ◽  
Interfacial Reaction ◽  
Low Cost ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

Zn20Sn solder with the melting point of 383.9°C and a low cost is considered as an ideal high-temperature lead-free solder. In the paper a new solder alloys were made by adding trace Cu into Zn20Sn alloy through alloying principle. Interfacial reaction and solderability of Zn20SnxCu (x=0 wt.%, 2 wt.%, 4 wt.% and 6 wt.%) solder on the copper substrate were investigated. Results showed that β’-CuZn, γ-Cu5Zn8 and ε-CuZn5 IMC layers were formed at the interface of Zn20SnxCu/Cu. The spreading areas of the Zn20SnxCu solders were reduced linearly with the increasing of the content of copper. The spreading aera of Zn20Sn solder was 52.88 mm2 while that of Zn20Sn6Cu was 50.82mm2 which was approximately 3.9% smaller than that of matrix solder. It is mainly related to the formation of ε-CuZn5 phase and the metal intermetallic compound between the solder and the substrate.

scholarly journals The Effect of Germanium Addition on the Lead-free Solder Alloys: A Short Review

2020 ◽  
Vol 957 ◽  
pp. 012060
Author(s):  
Chi Ying Tan ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Norainiza Saud
Keyword(s):  
Short Review ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Free Solder

The Effects of Gallium Additions on the Microstructure of Lead-Free Solder Materials: A Short Review

2018 ◽  
Vol 280 ◽  
pp. 187-193 ◽  
Author(s):  
S.F. Nazri ◽  
Mohd Arif Anuar Mohd Salleh
Keyword(s):  
Copper Substrate ◽  
Short Review ◽  
Joint Surface ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Imcs Layer ◽  
Solid Solution Strengthening ◽  
Solution Strengthening ◽  
Free Solder ◽  
Interfacial Intermetallic Compounds

This paper reviews the results of gallium (Ga) additions on the properties of Lead (Pb)-free solder alloys in terms of the solderability, microstructure and mechanical properties. Throughout the review, it is proven that when 0.5% of Ga is added, the shear force is improved and the grain size of the solder has refined remarkably. Besides, the addition of Ga has significantly suppressed the interfacial intermetallic compounds (IMCs) formation at solder/Copper substrate interface. This is caused by the formation of the Cu2Ga phase around the joint surface during solidification which decrease the growth rate of the IMCs layer. In fact, the enhancement in the mechanical aspect can also be affiliated with the improvement of the IMCs of the solder due to the addition of Ga. Moreover, Ga element also added to act as solid solution strengthening in β-Sn matrix. Furthermore, the addition of Ga element definitely decreases the melting temperature of Pb-free solder in Sn-0.7Cu Pb-free solder. As Ga addition also improve the oxidation resistance and reduce the surface tension of the solder, thus the solderability of the Pb-free solder alloys is slightly improved.

scholarly journals INTERMETALLIC COMPOUNDS FORMATION OF SOLDER ALLOYS ON Ni/Au SURFACE FINISH COPPER

2020 ◽  
Vol 26 (4) ◽  
pp. 184-187
Author(s):  
Ngoc Binh Duong
Keyword(s):  
Intermetallic Compounds ◽  
Melting Temperature ◽  
Surface Finish ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Soldering Temperature ◽  
Substrate Interface ◽  
Free Solder

Intermetallic compounds (IMCs) formation between lead-free solder alloys (Sn-9Zn and Sn-8Zn-3Bi) and Ni/Au surface finish copper substrate were studied. Reaction between the solder and the substrate was carried out at regular soldering temperature, approx. 50 °C above the melting temperature of the solder alloys. Results indicated that Au-Zn was the IMC formed at the interface and the Au layer which is electro-plated on the substrate has completely dissolved into the solder alloys. The amount of Au available at the interface is an important factor that influent the morphology of the IMC with thicker Au layer on the substrate resulted in thicker layer of IMC at the interface. Although Bi does not taken part in the composition of IMC, it influent the formation of IMC, the IMC formed in the Sn9Zn/substrate interface was Au5Zn3, meanwhile it was g2-AuZn3 in the Sn-8Zn-3Bi/substrate interface.

scholarly journals Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review

2013 ◽  
Vol 2013 ◽  
pp. 1-11 ◽  
Author(s):  
Liu Mei Lee ◽  
Ahmad Azmin Mohamad
Keyword(s):  
Interfacial Reaction ◽  
Electronics Industry ◽  
Lead Free ◽  
Lead Free Solder ◽  
Substrate Selection ◽  
Solder Alloys ◽  
Promising Candidate ◽  
Microelectronic Technology ◽  
Free Solder ◽  
Selection Of

This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

Electrodeposition as an Alternative Route to Prepare Nanostructured Lead-Free Solder Alloy: A Short Review

2015 ◽  
Vol 1113 ◽  
pp. 554-559
Author(s):  
Sakinah Mohd Yusof ◽  
Md Amin Hashim ◽  
Junaidah Jai ◽  
Abdul Hadi
Keyword(s):  
Solder Alloy ◽  
Short Review ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Electronic Manufacturing ◽  
Melting Temperatures ◽  
Magnetization Density ◽  
Free Solder ◽  
Lead Free Solders

With world-wide strict legislation for reduction or removal of lead from industrial waste, development of a large number of lead-free alternative solder materials had been intensively examined. The drive for lead-free solders development was towards systems that can imitate conventional lead containing solder alloys in terms of melting temperatures and improvement of mechanical properties. Nanostructured solder alloy, with a grain size of typically < 100 nm, was a new class of materials with properties distinct from and frequently distinguished to those of the conventional alloy. In comparison, nanostructured solder alloys exhibit higher strength and hardness, enhanced diffusivity, and excellent soft and hard magnetic properties. Numerous different techniques were performed to synthesize these nanostructured solder alloys. Electrodeposition method has generated huge interest in nanostructured solder preparation, mainly due to its ability to deposit solders selectively and uniformly at nanoscale. These factors bring significant influences on the behaviors of products, such as magnetization, density, ductility, wear resistance, corrosion resistance, porosity, molecular structure, and crystal properties which plays a vital part in the field of electronic manufacturing. In this paper, a short review on the electrodeposition, a useful technique to deposit different metals and alloys, as a method for nanostructured lead-free solder alloys preparation is presented.

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