Finite element simulation of mesoscale inhomogeneous deformation in 304 stainless steel foil tensile

2019 ◽  
Vol 6 (9) ◽  
pp. 096540 ◽  
Author(s):  
Wanwan Fan ◽  
Zhongkai Ren ◽  
Jie Hou ◽  
Tao Wang
2011 ◽  
Vol 134 (1) ◽  
Author(s):  
S. Feli ◽  
M. E. Aalami Aaleagha ◽  
M. Foroutan ◽  
E. Borzabadi Farahani

In this paper, a finite element simulation, based on abaqus software is presented for analyzing the temperature history and the residual stress states in multipass welds in stainless steel pipe. The uncoupled thermal–mechanical a three-dimensional (3D) model and a two-dimensional (2D) model are developed. The volumetric heat source with double ellipsoidal distribution for front and rear heat source, proposed by Goldak and Akhlaghi, has also been used. Furthermore, a moving heat source has been modeled by abaqus subroutine DFLUX. A user subroutine FILM has also been used to simulate the combined thermal boundary conditions. The results of both a 3D model and a 2D axisymmetric model which are compared with the available experimental measurements show good agreements. Predictions show that the axial and hoop residual stresses in a 3D model and a 2D axisymmetric model have the same distributions in all locations except the starting point of welding. The effects of welding sequences on the thermal and structural analysis are also investigated. Four types of welding sequences for circular welds of pipe have been used and thermal history and axial and hoop residual stresses are compared. Predictions show that for other locations (except the starting point of welding) there are no important differences of axial and hoop residual stresses for welding sequences and they have the same distribution along axial direction.


2008 ◽  
Vol 587-588 ◽  
pp. 839-843 ◽  
Author(s):  
Carlos W. Moura e Silva ◽  
Jose R.T. Branco ◽  
Marta C. Oliveira ◽  
Jorge M. Antunes ◽  
Albano Cavaleiro

In this work, Si-doped DLC films were deposited on stainless steel (316SS) and polycarbonate (PC) substrates by RF-PACVD in gas mixtures of SiH4+CH4, with 2, 5 and 10 vol.% SiH4. The increase of the Si content in the films led to a progressive drop in the hardness from 30 GPa down to 23 GPa whereas the elastic modulus increased from 124 GPa up to 146 GPa, as measured in the SS coated substrates. In the case of coated PC samples pop-in was observed in the loading curve which was interpreted by finite element simulation and nanoscratching techniques.


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