scholarly journals Dirac Magic and Lifshitz Transitions in AA-Stacked Twisted Multilayer Graphene

2022 ◽  
Vol 128 (2) ◽  
Author(s):  
Yantao Li ◽  
Adam Eaton ◽  
H. A. Fertig ◽  
Babak Seradjeh
2020 ◽  
Author(s):  
Vera Marinova ◽  
Stefan Petrov ◽  
Blagovest Napoleonov ◽  
Jordan Mickovski ◽  
Dimitrina Petrova ◽  
...  

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Youngbin Tchoe ◽  
Janghyun Jo ◽  
HoSung Kim ◽  
Heehun Kim ◽  
Hyeonjun Baek ◽  
...  

AbstractWe report monolithic integration of indium arsenide (InAs) nanorods and zinc oxide (ZnO) nanotubes using a multilayer graphene film as a suspended substrate, and the fabrication of dual-wavelength photodetectors with the hybrid configuration of these materials. For the hybrid nanostructures, ZnO nanotubes and InAs nanorods were grown vertically on the top and bottom surfaces of the graphene films by metal-organic vapor-phase epitaxy and molecular beam epitaxy, respectively. The structural, optical, and electrical characteristics of the hybrid nanostructures were investigated using transmission electron microscopy, spectral photoresponse analysis, and current–voltage measurements. Furthermore, the hybrid nanostructures were used to fabricate dual-wavelength photodetectors sensitive to both ultraviolet and mid-infrared wavelengths.


Author(s):  
Mingcan Cui ◽  
Xiaoling Zhong ◽  
Yong Fang ◽  
Haoxuan Sheng ◽  
Tingting Guo ◽  
...  

2021 ◽  
Author(s):  
Yao Cong ◽  
Qiaoran Jin ◽  
Qi Huang ◽  
Zijie Xu

Multilayer graphene (MLG) are in situ formed in matrix of amorphous carbons prepared from carbonized waste paper at 750 ℃. The resultant samples are systematically characterized by morphology, spectroscopy, diffractometry,...


2021 ◽  
Vol 5 (1) ◽  
Author(s):  
Myungwoo Son ◽  
Jaewon Jang ◽  
Yongsu Lee ◽  
Jungtae Nam ◽  
Jun Yeon Hwang ◽  
...  

AbstractHere, we demonstrate the fabrication of a Cu-graphene heterostructure interconnect by the direct synthesis of graphene on a Cu interconnect with an enhanced performance. Multilayer graphene films were synthesized on Cu interconnect patterns using a liquid benzene or pyridine source at 400 °C by atmospheric pressure chemical vapor deposition (APCVD). The graphene-capped Cu interconnects showed lower resistivity, higher breakdown current density, and improved reliability compared with those of pure Cu interconnects. In addition, an increase in the carrier density of graphene by doping drastically enhanced the reliability of the graphene-capped interconnect with a mean time to failure of >106 s at 100 °C under a continuous DC stress of 3 MA cm−2. Furthermore, the graphene-capped Cu heterostructure exhibited enhanced electrical properties and reliability even if it was a damascene-patterned structure, which indicates compatibility with practical applications such as next-generation interconnect materials in CMOS back-end-of-line (BEOL).


Author(s):  
Jazael Gómez ◽  
Arturo Estrada ◽  
Argelia Balbuena Ortega ◽  
Oscar Arredondo ◽  
Rocío Nava ◽  
...  

2021 ◽  
Vol 33 (7) ◽  
pp. 2506-2515
Author(s):  
Xinyu Huang ◽  
Wen Zhao ◽  
Chongyang Zhu ◽  
Xianjue Chen ◽  
Xu Han ◽  
...  

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