Modelling and simulation of crossing striplines in printed circuit boards or multichip modules

1992 ◽  
Author(s):  
A-K. Hamid ◽  
Z. Mu
Keyword(s):  
Printed Circuit Boards ◽  
Modelling And Simulation ◽  
Multichip Modules ◽  
Circuit Boards ◽  
Printed Circuit

scholarly journals Design and Implementation of Jtag Compatible 4-Bit Multiplier

2020 ◽  
Vol 9 (1) ◽  
pp. 1317-1320
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Device ◽  
Multichip Modules ◽  
The Novel ◽  
Boundary Scan ◽  
Circuit Boards ◽  
Access Port ◽  
Printed Circuit ◽  
Industry Standard ◽  
Board Level

The novel scan- based methodology was developed and resulted in system designers agreeing on it due to the rising complication of boards and also enhancement of technologies like multichip modules. It is called as boundary scan testing for the board level chips. This method was established by the Joint Test Access Group. It was named as JTAG. JTAG was developed for verifying designs and testing printed circuit boards after manufacture. A JTAG interface is a special interface added to a chip. Traditional test technologies require very large and expensive equipment. The most aim of this paper is to style and implement 4-bit multiplier using this standard. The designs were being verified and the circuit boards were being tested after the manufacture by using the industry standard JTAG. It is employed because of accessing sub-blocks of chips. It's a very important mechanism for debugging embedded systems. Boundary-scan cells created exploitation electronic device and latch circuits square measure hooked up to each pin on the device. These cells, embedded among the device, will capture knowledge from pin or core logic signals conjointly as force knowledge onto pins. Captured knowledge is serially shifted out through the JTAG take a look at Access Port (TAP) and will be compared to expected values to figure out a pass or fail result. Forced take a look at knowledge is serially shifted into the boundary-scan cells.

Slit Effect of Common Ground Patterns in Affecting Cross-Talk Noise between Two Parallel Signal Traces on Printed Circuit Boards

2008 ◽  
Vol 128 (11) ◽  
pp. 657-662 ◽  
Author(s):  
Tsuyoshi Maeno ◽  
Yukihiko Sakurai ◽  
Takanori Unou ◽  
Kouji Ichikawa ◽  
Osamu Fujiwara
Keyword(s):  
Cross Talk ◽  
Printed Circuit Boards ◽  
Common Ground ◽  
Circuit Boards ◽  
Printed Circuit

Influence of Component Mounting Density on Oscillating Characteristics of Multilayer Printed Circuit Boards

2018 ◽  
Vol 23 (2) ◽  
pp. 141-148
Author(s):  
S.Sh. Rekhviashvili ◽  
◽  
M.O. Mamchuev ◽  
V.V. Narozhnov ◽  
M.M. Oshkhunov ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Oscillating Characteristics

Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

2013 ◽  
Vol 61 (3) ◽  
pp. 731-735
Author(s):  
A.W. Stadler ◽  
Z. Zawiślak ◽  
W. Stęplewski ◽  
A. Dziedzic
Keyword(s):  
Thin Film ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Noise Component ◽  
Printed Circuit ◽  
Resistance Bridge ◽  
Different Types ◽  
Signal Path ◽  
Resistance Fluctuations ◽  
Made In

Abstract. Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

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