System level modeling of smart power switches using SystemC-AMS for digital protection concept verification

2009 ◽  
Author(s):  
Hans-Peter Kreuter ◽  
Vladimir Kosel ◽  
Michael Glavanovics ◽  
Robert Illing
Keyword(s):  
System Level ◽  
Smart Power ◽  
System Level Modeling ◽  
Power Switches ◽  
Digital Protection

scholarly journals DESIGN AND TECHNOLOGICAL FEATURES OF CERAMIC-METAL TO-247 AND TO-220 SEMICONDUCTOR PACKAGES

2020 ◽  
Vol 257 (2) ◽  
pp. 22-27
Author(s):  
V.A. Sidorov ◽  
A.G. Chuprunov ◽  
S.V. Kataev ◽  
K.V. Sidorov
Keyword(s):  
Pulsed Current ◽  
Operating Voltage ◽  
Smart Power ◽  
Power Switches ◽  
Semiconductor Packages ◽  
Glass Metal

In this paper we introduce the design of sealed ceramic-metal TO-247 and TO-220 packages, which are intended for the same applications as plactic-metal and glass-metal alternatives. Packages could be used for epitaxial Si and SiC multi-die assemblies, for GaN smart power switches, etc., with operating voltage up to 2500 V and pulsed current up to 350 A.

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