DESIGN AND TECHNOLOGICAL FEATURES OF CERAMIC-METAL TO-247
AND TO-220 SEMICONDUCTOR PACKAGES

In this paper we introduce the design of sealed ceramic-metal TO-247 and TO-220 packages, which are intended for the same applications as plactic-metal and glass-metal alternatives. Packages could be used for epitaxial Si and SiC multi-die assemblies, for GaN smart power switches, etc., with operating voltage up to 2500 V and pulsed current up to 350 A.

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Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch Design

International Symposium on Microelectronics ◽

10.4071/2380-4505-2020.1.000015 ◽

2020 ◽

Vol 2020 (1) ◽

pp. 000015-000020

Author(s):

Min Chu ◽

Jie Chen ◽

Abidur Rahman ◽

Rajen Murugan

Keyword(s):

Electrical Performance ◽

Diagnostic Feature ◽

Electromagnetic Modeling ◽

Smart Power ◽

Modeling Methodology ◽

Power Switch ◽

High Side ◽

Die Attach ◽

Power Switches ◽

The Impact

Abstract Generally, IC packages with exposed pads have excellent thermal and electrical performance – assuming high fidelity and integrity of die attach material. However, reliability challenges associated with die attach impacts electrical performance of vertical power FETs for high-side power switches. As such, it is critical to quantify the impact of these challenges on high-side power switches operation, so that their protection and diagnostic feature circuitries can be properly designed for mission critical applications. In this paper we present on a package and PCB co-modeling methodology that was developed to assess impact of die attach integrity on performance of high-side power switch designs. We explain how electrical co-optimization of the system (viz. FET-Package-PCB) interactions, was achieved through a coupled circuit-to-electromagnetic modeling, simulation, and analysis methodology. Silicon laboratory measurements data that validate the modeling methodology will be presented.

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A compact high current system for short circuit testing of smart power switches according to AEC standard Q100-012

2008 IEEE Power Electronics Specialists Conference ◽

10.1109/pesc.2008.4592209 ◽

2008 ◽

Cited By ~ 2

Author(s):

Michael Glavanovics ◽

Roland Sleik ◽

Christoph Schreiber

Keyword(s):

Current System ◽

Short Circuit ◽

High Current ◽

Circuit Testing ◽

Smart Power ◽

Power Switches

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PROFET II-a second generation family of smart power switches

10.1109/eait.1990.205480 ◽

2002 ◽

Author(s):

J.M. Hancock

Keyword(s):

Second Generation ◽

Smart Power ◽

Generation Family ◽

Power Switches

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Twenty-First Century Truck Electronics—Today's Global Challenge

Proceedings of the Institution of Mechanical Engineers Part D Journal of Automobile Engineering ◽

10.1243/pime_proc_1989_203_141_02 ◽

1989 ◽

Vol 203 (1) ◽

pp. 1-9

Author(s):

G D Aravosis

Keyword(s):

Fuel Economy ◽

Geographic Area ◽

The United States ◽

Electronic Systems ◽

Smart Power ◽

Global Challenge ◽

Regulatory Standards ◽

Future System ◽

Power Switches ◽

The Cost

The main catalyst for use of state-of-the-art electronics in commercial trucks in the United States is the need to meet EPA emission standards for the 1990s. Important secondary catalysts are fuel economy, anti-lock brake systems and fleet/driver expectations. There are also myriad other forces related to safety, maintainability, servicing and communication which will be satisfied once electronic systems are installed in trucks. The principal economic justification for incurring the cost of electronics at this time is to satisfy these more stringent gaseous emission and particulate regulatory standards. Using electronics, these standards can be met without producing a severe reduction in fuel economy while, as a by-product, interfacing with other truck components, such as brakes, transmissions, safety controls etc. This paper will address the applications of electronics today for diesel engine controls as well as the applications of electronics in areas such as smart power switches, anti-jackknife controls, voice-recognition systems and other future system applications. The exploding use of electronics in trucks will require solutions to many complex problems which are not unique to any one company, geographic area, country or technical society.

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