Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

2010 ◽  
Author(s):  
Mitsumasa Koyanagi ◽  
Takafumi Fukushima ◽  
Tetsu Tanaka
Keyword(s):  
Wafer Bonding ◽  
Three Dimensional ◽  
Integration Technology

Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

2006 ◽  
Vol 53 (11) ◽  
pp. 2799-2808 ◽  
Author(s):  
M. Koyanagi ◽  
T. Nakamura ◽  
Y. Yamada ◽  
H. Kikuchi ◽  
T. Fukushima ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Three Dimensional ◽  
Integration Technology

New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration

2006 ◽  
Vol 45 (4B) ◽  
pp. 3030-3035 ◽  
Author(s):  
Takafumi Fukushima ◽  
Yusuke Yamada ◽  
Hirokazu Kikuchi ◽  
Mitsumasa Koyanagi
Keyword(s):  
Wafer Bonding ◽  
Three Dimensional ◽  
Integration Technology

New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration

2005 ◽  
Author(s):  
Takafumi Fukushima ◽  
Yusuke Yamada ◽  
Hirokazu Kikuchi ◽  
Mitsumasa Koyanagi
Keyword(s):  
Wafer Bonding ◽  
Three Dimensional ◽  
Integration Technology
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