New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique

2007 IEEE International Electron Devices Meeting ◽

10.1109/iedm.2007.4419119 ◽

2007 ◽

Author(s):

Takafumi Fukushima ◽

Hirokazu Kikuchi ◽

Yusuke Yamada ◽

Takayuki Konno ◽

Jun Liang ◽

...

Keyword(s):

Wafer Bonding ◽

Three Dimensional ◽

Integration Technology ◽

Bonding Technique

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Wafer-Level Three-Dimensional Hyper-Integration Technology Using Dielectric Adhesive Wafer Bonding

Materials for Information Technology - Engineering Materials and Processes ◽

10.1007/1-84628-235-7_33 ◽

2006 ◽

pp. 405-417 ◽

Author(s):

J. -Q. Lu ◽

T. S. Cale ◽

R. J. Gutmann

Keyword(s):

Wafer Bonding ◽

Three Dimensional ◽

Wafer Level ◽

Integration Technology

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Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections

IEEE Transactions on Electron Devices ◽

10.1109/ted.2006.884079 ◽

2006 ◽

Vol 53 (11) ◽

pp. 2799-2808 ◽

Author(s):

M. Koyanagi ◽

T. Nakamura ◽

Y. Yamada ◽

H. Kikuchi ◽

T. Fukushima ◽

...

Keyword(s):

Wafer Bonding ◽

Three Dimensional ◽

Integration Technology

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New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super-Chip Integration

Japanese Journal of Applied Physics ◽

10.1143/jjap.45.3030 ◽

2006 ◽

Vol 45 (4B) ◽

pp. 3030-3035 ◽

Author(s):

Takafumi Fukushima ◽

Yusuke Yamada ◽

Hirokazu Kikuchi ◽

Mitsumasa Koyanagi

Keyword(s):

Wafer Bonding ◽

Three Dimensional ◽

Integration Technology

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Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding

IEEE Custom Integrated Circuits Conference 2010 ◽

10.1109/cicc.2010.5617626 ◽

2010 ◽

Author(s):

Mitsumasa Koyanagi ◽

Takafumi Fukushima ◽

Tetsu Tanaka

Keyword(s):

Wafer Bonding ◽

Three Dimensional ◽

Integration Technology

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Three-Diensional Integration Technology Based on Wafer Bonding Technique Using Micro-Bumps

10.7567/ssdm.1995.lb-l6 ◽

1995 ◽

Author(s):

T. Matsumoto ◽

Y. Kudoh ◽

M. Tahara ◽

K.-H. Yu ◽

N. Miyakawa ◽

...

Keyword(s):

Wafer Bonding ◽

Integration Technology ◽

Bonding Technique

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New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration

10.7567/ssdm.2005.c-2-3 ◽

2005 ◽

Author(s):

Takafumi Fukushima ◽

Yusuke Yamada ◽

Hirokazu Kikuchi ◽

Mitsumasa Koyanagi

Keyword(s):

Wafer Bonding ◽

Three Dimensional ◽

Integration Technology

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Fully Epitaxial Giant Magnetoresistive Devices with Half-Metallic Heusler Alloy Fabricated on Poly-Crystalline Electrode Using Three-Dimensional Integration Technology

SSRN Electronic Journal ◽

10.2139/ssrn.3559968 ◽

2020 ◽

Author(s):

Jiamin Chen ◽

Yuya Sakuraba ◽

Kay Yakushiji ◽

Yuichi Kurashima ◽

Naoya Watanabe ◽

...

Keyword(s):

Heusler Alloy ◽

Three Dimensional ◽

Half Metallic ◽

Integration Technology

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Wiring requirement and three-dimensional integration technology for field programmable gate arrays

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2003.810003 ◽

2003 ◽

Vol 11 (1) ◽

pp. 44-54 ◽

Author(s):

A. Rahman ◽

S. Das ◽

A.P. Chandrakasan ◽

R. Reif

Keyword(s):

Three Dimensional ◽

Field Programmable Gate Arrays ◽

Integration Technology ◽

Gate Arrays ◽

Field Programmable ◽

Programmable Gate Arrays

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Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159775 ◽

2015 ◽

Author(s):

Makoto Motoyoshi ◽

Kohki Yanagimura ◽

Junichi Takanohashi ◽

Mariappan Murugesan ◽

Masahiro Aoyagi ◽

...

Keyword(s):

Three Dimensional ◽

Integration Technology ◽

Sensor Application

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Variable Threshold AlGaAs/InGaAs Heterostructure Field-Effect Transistors with Paired Gates Fabricated Using the Wafer-Bonding Technique

Japanese Journal of Applied Physics ◽

10.1143/jjap.39.2435 ◽

2000 ◽

Vol 39 (Part 1, No. 4B) ◽

pp. 2435-2438

Author(s):

Satoshi Kodama ◽

Tomofumi Furuta ◽

Noriyuki Watanabe ◽

Hiroshi Ito ◽

Atsushi Kanda ◽

...

Keyword(s):

Wafer Bonding ◽

Field Effect ◽

Field Effect Transistors ◽

Variable Threshold ◽

Heterostructure Field Effect Transistors ◽

Bonding Technique

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