Generation of mechanical interference fringes by multi-photon quantum measurement

2017 ◽  
Author(s):  
M. Ringbauer ◽  
T. J. Weinhold ◽  
A. G. White ◽  
M. R. Vanner
Keyword(s):  
Quantum Measurement ◽  
Interference Fringes ◽  
Mechanical Interference

scholarly journals Generation of mechanical interference fringes by multi-photon counting

2018 ◽  
Vol 20 (5) ◽  
pp. 053042 ◽  
Author(s):  
M Ringbauer ◽  
T J Weinhold ◽  
L A Howard ◽  
A G White ◽  
M R Vanner
Keyword(s):  
Photon Counting ◽  
Interference Fringes ◽  
Mechanical Interference

Quanitative aspects of electron diffraction using electron holography

1995 ◽  
Vol 53 ◽  
pp. 616-617
Author(s):  
E. Völkl ◽  
L.F. Allard ◽  
B. Frost ◽  
T.A. Nolan
Keyword(s):  
Electron Beam ◽  
Electron Diffraction ◽  
Software Package ◽  
Spatial Coherence ◽  
Electron Holography ◽  
Image Intensity ◽  
Interference Fringes ◽  
Complex Image ◽  
The Difference ◽  
Recorded Image

Off-axis electron holography has the well known ability to preserve the complex image wave within the final, recorded image. This final image described by I(x,y) = I(r) contains contributions from the image intensity of the elastically scattered electrons IeI (r) = |A(r) exp (iΦ(r)) |, the contributions from the inelastically scattered electrons IineI (r), and the complex image wave Ψ = A(r) exp(iΦ(r)) as:(1) I(r) = IeI (r) + Iinel (r) + μ A(r) cos(2π Δk r + Φ(r))where the constant μ describes the contrast of the interference fringes which are related to the spatial coherence of the electron beam, and Φk is the resulting vector of the difference of the wavefront vectors of the two overlaping beams. Using a software package like HoloWorks, the complex image wave Ψ can be extracted.

Quantum Measurement

1992 ◽  
Author(s):  
Vladimir B. Braginsky ◽  
Farid Ya Khalili ◽  
Kip S. Thorne
Keyword(s):  
Quantum Measurement

Quantum Measurement

1996 ◽  
Vol 193 (Part_1_2) ◽  
pp. 226-227
Author(s):  
H. Schmiedel
Keyword(s):  
Quantum Measurement

Silicon Fringe Sample Metrology—A Thickness Measurement Technique

2013 ◽  
Author(s):  
Mark Kimball
Keyword(s):  
Temperature Dependence ◽  
Temperature Coefficient ◽  
Measurement Technique ◽  
Thickness Measurement ◽  
Sample Thickness ◽  
Index Of Refraction ◽  
Interference Fringes ◽  
Noncontact Method ◽  
Thickness Variations

Abstract Silicon’s index of refraction has a strong temperature coefficient. This temperature dependence can be used to aid sample thinning procedures used for backside analysis, by providing a noncontact method of measuring absolute sample thickness. It also can remove slope ambiguity while counting interference fringes (used to determine the direction and magnitude of thickness variations across a sample).

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