Real-time in-situ measurement of the penetration depth in short pulse laser percussion drilling of metal targets

2011 ◽  
Author(s):  
F. P. Mezzapesa ◽  
A. Ancona ◽  
T. Sibillano ◽  
F. De Lucia ◽  
M. Dabbicco ◽  
...  
Keyword(s):  
Real Time ◽  
Penetration Depth ◽  
Pulse Laser ◽  
Short Pulse ◽  
In Situ Measurement ◽  
Short Pulse Laser ◽  
Laser Percussion Drilling ◽  
Percussion Drilling

Laser self-mixing sensor to monitor in situ the penetration depth during short pulse laser drilling of metal targets

2011 ◽  
Author(s):  
Francesco P. Mezzapesa ◽  
Antonio Ancona ◽  
Teresa Sibillano ◽  
Francesco De Lucia ◽  
Maurizio Dabbicco ◽  
...  
Keyword(s):  
Penetration Depth ◽  
Pulse Laser ◽  
Short Pulse ◽  
Laser Drilling ◽  
Short Pulse Laser

scholarly journals Real-time control of polarisation in ultra-short-pulse laser micro-machining

2012 ◽  
Vol 107 (2) ◽  
pp. 445-454 ◽  
Author(s):  
O. J. Allegre ◽  
W. Perrie ◽  
K. Bauchert ◽  
D. Liu ◽  
S. P. Edwardson ◽  
...  
Keyword(s):  
Real Time ◽  
Pulse Laser ◽  
Short Pulse ◽  
Micro Machining ◽  
Real Time Control ◽  
Short Pulse Laser ◽  
Time Control ◽  
Laser Micro Machining ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Real-Time Optimization of Proton Production by Intense Short-Pulse Laser with Time-of-Flight Measurement

2006 ◽  
Vol 45 (No. 34) ◽  
pp. L913-L916 ◽  
Author(s):  
Shu Nakamura ◽  
Yoshihisa Iwashita ◽  
Akira Noda ◽  
Toshiyuki Shirai ◽  
Hiromu Tongu ◽  
...  
Keyword(s):  
Real Time ◽  
Pulse Laser ◽  
Short Pulse ◽  
Time Of Flight ◽  
Short Pulse Laser ◽  
Time Optimization ◽  
Proton Production ◽  
Flight Measurement ◽  
Real Time Optimization

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

Chromium oxide dissolution in steels via short pulse laser processing

2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov
Keyword(s):  
Pulse Laser ◽  
Chromium Oxide ◽  
Laser Processing ◽  
Short Pulse ◽  
Oxide Dissolution ◽  
Short Pulse Laser
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