High Density Silicon Photonic Integrated Circuits and Photonic Engine for Optical Co-packaged Ethernet Switch

Author(s):  
Ling Liao ◽  
Saeed Fathololoumi ◽  
David Hui
2018 ◽  
Vol 24 (6) ◽  
pp. 1-10 ◽  
Author(s):  
Yu Zhang ◽  
Yi-Chun Ling ◽  
Yichi Zhang ◽  
Kuanping Shang ◽  
S. J. Ben Yoo

2015 ◽  
Vol 2015 (1) ◽  
pp. 000616-000620 ◽  
Author(s):  
S. Bernabé ◽  
G. Pares ◽  
B. Blampey ◽  
K. Rida ◽  
O. Castany ◽  
...  

Achieving high data speed (typically Nx25 Gbps) compact optoelectronic modules is now made possible by using Photonic Integrated Circuits (PIC) combined with CMOS electronic drivers. Among the techniques that can be used to combine both circuits, flip-chip assembly based on micro-bumps shows several advantages, for example low RF parasitics and high density compared to wire bonding. Using this technique, it is possible to build low consumption photonic receivers working at 25 Gbps.


2017 ◽  
Vol 29 (21) ◽  
pp. 1896-1899 ◽  
Author(s):  
Xinru Wu ◽  
Ke Xu ◽  
Wen Zhou ◽  
Chi Wai Chow ◽  
Hon Ki Tsang

2020 ◽  
Vol 14 (9) ◽  
pp. 578-584 ◽  
Author(s):  
R. Maiti ◽  
C. Patil ◽  
M. A. S. R. Saadi ◽  
T. Xie ◽  
J. G. Azadani ◽  
...  

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