The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor

2009 ◽  
Author(s):  
Richard Coyle ◽  
Michael Reid ◽  
Claire Ryan ◽  
Richard Popowich ◽  
Peter Read ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Thermal Fatigue ◽  
Alloy Composition ◽  
Processing Parameters ◽  
Fatigue Performance ◽  
Free Solder

Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

2005 ◽  
Vol 53 (8) ◽  
pp. 927-932 ◽  
Author(s):  
M.A. Matin ◽  
E.W.C. Coenen ◽  
W.P. Vellinga ◽  
M.G.D. Geers
Keyword(s):  
Solder Alloy ◽  
Thermal Fatigue ◽  
Thermal Anisotropy ◽  
Free Solder

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

Thermal Fatigue Performance Test of Casting Roller Sleeve Material Heated by Laser Scanning

2017 ◽  
Vol 54 (4) ◽  
pp. 041412
Author(s):  
刘晓博 Liu Xiaobo ◽  
王之桐 Wang Zhitong ◽  
李文 Li Wen
Keyword(s):  
Thermal Fatigue ◽  
Laser Scanning ◽  
Performance Test ◽  
Fatigue Performance
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