FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00017 ◽

2021 ◽

Author(s):

Yuki Susumago ◽

Tomo Odashima ◽

Masatsugu Ichikawa ◽

Hiroki Hanaoka ◽

Hisashi Kino ◽

...

Keyword(s):

3D Ic ◽

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TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC

IEICE Transactions on Electronics ◽

10.1587/transele.e95.c.1864 ◽

2012 ◽

Vol E95.C (12) ◽

pp. 1864-1871 ◽

Author(s):

Hung Viet NGUYEN ◽

Myunghwan RYU ◽

Youngmin KIM

Keyword(s):

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Electroactive Polymers for Smart Skin Applications

10.21236/ada378481 ◽

2000 ◽

Author(s):

Qiming Zhang

Keyword(s):

Electroactive Polymers ◽

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Inkjet‐/ 3D ‐/ 4D ‐Printed Nanotechnology‐Enabled Radar, Sensing, and RFID Modules for Internet of Things, “Smart Skin,” and “Zero Power” Medical Applications

Antenna and Sensor Technologies in Modern Medical Applications ◽

10.1002/9781119683285.ch11 ◽

2021 ◽

pp. 399-434

Author(s):

Manos M. Tentzeris ◽

Aline Eid ◽

Tong‐Hong Lin ◽

Jimmy G.D. Hester ◽

Yepu Cui ◽

...

Keyword(s):

Internet Of Things ◽

Medical Applications ◽

Radar Sensing ◽

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A TSV-Last Approach for 3D-IC Integration and Packaging using WNi Platable Barrier Layer

2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32696.2021.00060 ◽

2021 ◽

Author(s):

Murugesan Mariappan ◽

Kiyoharu Mori ◽

Mitsumasa Koyanagi ◽

Takafumi Fukushima

Keyword(s):

Barrier Layer ◽

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A Programmable Checker for Automated 2.5D/3D IC ESD Verification

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2020.3039608 ◽

2020 ◽

pp. 1-1

Author(s):

Dina Medhat ◽

Mohamed Dessouky ◽

Diaa Eldin Khalil

Keyword(s):

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A Wafer-scale Manufacturing Pathway for Fine-grained Vertical 3D-IC Technology

2021 22nd International Symposium on Quality Electronic Design (ISQED) ◽

10.1109/isqed51717.2021.9424282 ◽

2021 ◽

Author(s):

Sachin Bhat ◽

Sounak Shaun Ghosh ◽

Sourabh Kulkarni ◽

Mingyu Li ◽

Csaba Andras Moritz

Keyword(s):

3D Ic ◽

Wafer Scale ◽

Fine Grained ◽

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Thermal-mechanical performance analysis and structure optimization of the TSV in 3D IC

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2021.3062031 ◽

2021 ◽

pp. 1-1

Author(s):

Guigen Ye ◽

Zhimin Wang ◽

Xinjian Li ◽

Shifeng Xue ◽

Liang Gong

Keyword(s):

Performance Analysis ◽

Mechanical Performance ◽

Structure Optimization ◽

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Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs

Proceedings of the 2014 on International symposium on physical design - ISPD '14 ◽

10.1145/2560519.2560531 ◽

2014 ◽

Author(s):

Shreepad Panth ◽

Kambiz Samadi ◽

Yang Du ◽

Sung Kyu Lim

Keyword(s):

3D Ic ◽

Congestion Mitigation

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Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2011.5898537 ◽

2011 ◽

Author(s):

Yu-Min Lin ◽

Chau-Jie Zhan ◽

Jing-Ye Juang ◽

John H. Lau ◽

Tai-Hong Chen ◽

...

Keyword(s):

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TSV integration with 20nm CMOS technology for 3D-IC enablement

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412407 ◽

2015 ◽

Author(s):

Shan Gao ◽

Sukeshwar Kannan ◽

Daniel Smith ◽

Rahul Agarwal ◽

Ramakanth Alapati

Keyword(s):

Cmos Technology ◽

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