Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates

2003 ◽  
Author(s):  
Chiang-Ming Chuang ◽  
Po-Cheng Shi ◽  
Kwang-Lung Lin
Keyword(s):  
Interfacial Reaction ◽  
Lead Free ◽  
Metallic Substrates ◽  
Lead Free Solders

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid interfacial reaction

2008 ◽  
Vol 98 (1) ◽  
pp. 012029 ◽  
Author(s):  
Ning Zhao ◽  
Xuemin Pan ◽  
Haitao Ma ◽  
Chuang Dong ◽  
Shuhong Guo ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Liquid Structure ◽  
Lead Free ◽  
Lead Free Solders ◽  
Correlative Effect

Interfacial Reaction Between Tin-Zinc Based Solders and Copper

1997 ◽  
Vol 3 (S2) ◽  
pp. 715-716
Author(s):  
G. Ghosh ◽  
M. E. Fine
Keyword(s):  
Interfacial Reaction ◽  
High Performance ◽  
Solder Joints ◽  
Physical And Mechanical Properties ◽  
Lead Free ◽  
Eutectic Alloys ◽  
Solidification Behavior ◽  
Lead Free Solders ◽  
Melting And Solidification ◽  
Intermetallic Layers

Due to the interfacial reaction between the solder and substrate, either during manufacturing or in service, the solder joints may contain one or more intermetallic layers at the interface. While such intermetallic layers may provide strong bonding, they may also be responsible for problems associated with solderability and reliability of joints. Certain physical and mechanical properties of the intermetallic may determine the integrity and reliability of solder assembly. So far detailed analysis, modelling, and testing of simulated and actual joints have been performed with Pb-Sn solders. However, in view of the increasing environmental and legislative concerns, lead-free solders are currently being developed and designed for microelectronics applications. As the solder joints in high-performance electronic circuits are expected to carry increasing mechanical, electrical and thermal burdens, it is essential to address the technological and reliability issues for lead-free solders. Among the lead-free solders, tin-zinc based alloys can be designed to achieve melting and solidification behavior similar to those of lead-tin eutectic or near eutectic alloys.

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