Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

2000 ◽  
Vol 88 (11) ◽  
pp. 6359-6363 ◽  
Author(s):  
J. W. Jang ◽  
D. R. Frear ◽  
T. Y. Lee ◽  
K. N. Tu
Keyword(s):  
Interfacial Reaction ◽  
Lead Free ◽  
Under Bump Metallization ◽  
Lead Free Solders ◽  
Electroless Ni

scholarly journals The liquid structure of Sn-based lead-free solders and the correlative effect in liquid-solid interfacial reaction

2008 ◽  
Vol 98 (1) ◽  
pp. 012029 ◽  
Author(s):  
Ning Zhao ◽  
Xuemin Pan ◽  
Haitao Ma ◽  
Chuang Dong ◽  
Shuhong Guo ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Liquid Structure ◽  
Lead Free ◽  
Lead Free Solders ◽  
Correlative Effect

Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder

2013 ◽  
Vol 565 ◽  
pp. 11-16 ◽  
Author(s):  
Ying Yang ◽  
J.N. Balaraju ◽  
Ser Choong Chong ◽  
Hui Xu ◽  
Changqing Liu ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Lead Free ◽  
Electroless Ni

Interfacial Reaction Between Tin-Zinc Based Solders and Copper

1997 ◽  
Vol 3 (S2) ◽  
pp. 715-716
Author(s):  
G. Ghosh ◽  
M. E. Fine
Keyword(s):  
Interfacial Reaction ◽  
High Performance ◽  
Solder Joints ◽  
Physical And Mechanical Properties ◽  
Lead Free ◽  
Eutectic Alloys ◽  
Solidification Behavior ◽  
Lead Free Solders ◽  
Melting And Solidification ◽  
Intermetallic Layers

Due to the interfacial reaction between the solder and substrate, either during manufacturing or in service, the solder joints may contain one or more intermetallic layers at the interface. While such intermetallic layers may provide strong bonding, they may also be responsible for problems associated with solderability and reliability of joints. Certain physical and mechanical properties of the intermetallic may determine the integrity and reliability of solder assembly. So far detailed analysis, modelling, and testing of simulated and actual joints have been performed with Pb-Sn solders. However, in view of the increasing environmental and legislative concerns, lead-free solders are currently being developed and designed for microelectronics applications. As the solder joints in high-performance electronic circuits are expected to carry increasing mechanical, electrical and thermal burdens, it is essential to address the technological and reliability issues for lead-free solders. Among the lead-free solders, tin-zinc based alloys can be designed to achieve melting and solidification behavior similar to those of lead-tin eutectic or near eutectic alloys.

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