Fiber Optic Transceivers in Surface Mount Technology for High Performance and Low Cost Optical Interconnects

2006 ◽  
Author(s):  
Elaine Wong ◽  
Wai Hung ◽  
Sing Cheng ◽  
Thomas Choi ◽  
Shu-kin Yau ◽  
...  
Keyword(s):  
Optical Interconnects ◽  
High Performance ◽  
Fiber Optic ◽  
Low Cost ◽  
Surface Mount Technology ◽  
Surface Mount

scholarly journals A V-Shape Optical Pin Interface for Board Level Optical Interconnect

2018 ◽  
Vol 10 (1) ◽  
pp. 20
Author(s):  
Nur Najahatul Huda Saris ◽  
Osamu Mikami ◽  
Azura Hamzah ◽  
Sumiaty Ambran ◽  
Chiemi Fujikawa
Keyword(s):  
Optical Networks ◽  
Optical Interconnects ◽  
Printed Circuit Boards ◽  
Data Centers ◽  
Low Cost ◽  
Optical Interconnection ◽  
Surface Mount Technology ◽  
Optical Surface ◽  
Printed Wiring Board ◽  
Surface Mount

This paper introduces a new interface of an optical pin for Printed Circuit Boards (PCBs), the V-shape cut type which is an innovation from the 90-degree cut type optical pin. The effectiveness is determined by optical characteristics through OptiCAD and by experiment. The simulation used a model of ray tracing analysis which is a one to two (split) connection function model. For the experiment, a Polymer Optical Fibre (POF) V-shape optical pin has been fabricated. It was found that the V-shaped optical pin has a multi-branched function and is applicable to optical interconnection. Full Text: PDF ReferencesMikami, O., et al. Optical pin interface for 90-deg optical path conversion coupling to Printed Wiring Board. in Region 10 Conference (TENCON), 2016 IEEE. 2016. IEEE. CrossRef DeCusatis, C., Data center architectures, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 3-41. CrossRef Duranton, M., D. Dutoit, and S. Menezo, Key requirements for optical interconnects within data centers, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 75-94. CrossRef ITOH, Y., et al., Optical Coupling Characteristics of Optical Pin with 45° Micro Mirror for Optical Surface Mount Technology. Journal of The Japan Institute of Electronics Packaging, 2001. 4(6): p. 497-503. CrossRef Uchida, T. and O. Mikami, Optical surface mount technology. IEICE Transactions on Electronics, 1997. 80(1): p. 81-87. CrossRef Papakonstantinou, I., et al., Low-cost, precision, self-alignment technique for coupling laser and photodiode arrays to polymer waveguide arrays on multilayer PCBs. IEEE Transactions on Advanced Packaging, 2008. 31(3): p. 502-511. CrossRef Nakama, K., et al., Optical connection device. 2006, Google Patents. DirectLink Ramaswami, R., K. Sivarajan, and G. Sasaki, Optical networks: a practical perspective. 2009: Morgan Kaufmann. DirectLink Tong, X.C., Advanced materials for integrated optical waveguides. 2014: Springer. CrossRef

Miniature, high performance, low-cost fiber optic microphone

2005 ◽  
Vol 118 (3) ◽  
pp. 1406-1413 ◽  
Author(s):  
Joseph A. Bucaro ◽  
Nicholas Lagakos ◽  
Brian H. Houston ◽  
Jacek Jarzynski ◽  
Maxim Zalalutdinov
Keyword(s):  
High Performance ◽  
Fiber Optic ◽  
Low Cost

Lab-on-a-fiber: building a fiber optic sensing platform for low-cost and high-performance trace vapor TNT detection

2010 ◽  
Author(s):  
Jianjun Ma ◽  
Aldona Kos ◽  
Wojtek J. Bock ◽  
Xianzhe Li ◽  
Huy Nguyen ◽  
...  
Keyword(s):  
High Performance ◽  
Fiber Optic ◽  
Low Cost ◽  
Sensing Platform ◽  
Fiber Optic Sensing ◽  
Tnt Detection

A Novel Placement Method for Mini-Scale Passive Components in Surface Mount Technology

2021 ◽  
Author(s):  
Jingxi He ◽  
Yuqiao Cen ◽  
Yuanyuan Li ◽  
Shrouq Alelaumi ◽  
Daehan Won
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Superior Performance ◽  
Surface Mount Technology ◽  
Solder Paste ◽  
Passive Components ◽  
Surface Mount ◽  
Placement Method ◽  
Pick And Place ◽  
Comparative Results

Abstract This paper aims to propose a novel placing method, i.e., place-between-paste-and-pad (PB), for mini-scale passive components to enhance electronic assembly lines' yield. PB means a component is designed to be placed at the midpoint between the pastes and pads on the length direction while it aligns with the pads' center on the width direction. An experiment that involves 12 printed circuit boards (PCB) is designed and conducted to get comparative results. Four PCBs are employed for place-on-pad (PP), place-on-paste (PPS), and PB separately. On each board, 375 resistors R0402M (0.40 mm X 0.20 mm) are assembled horizontally. To study the components' misalignment under various solder paste offset conditions in different placement methods, a stencil with 25 solder paste offset settings is utilized. Based on this experiment's results, PB has superior performance to the other two methods to minimize components' misalignment. Regarding the number of acceptable components when post-reflow offsets are within 25% of components' dimensions, PB and PP have equivalent performances, and they both outperform PPS. Furthermore, PB is a low-cost placing strategy because PB needs not the real-time communication between the solder paste inspection machine and the pick-and-place machine. With the miniaturization trend in electronic products, the post-reflow components' misalignment is more frequently observed than before. The placement method proposed in this study is expected to offer a low-cost exploration in the component pick-and-place procedure to enhance the surface mount technology (SMT) assembly quality.

scholarly journals Low-cost high-performance fiber-optic pH sensor based on thin-core fiber modal interferometer

2009 ◽  
Vol 17 (25) ◽  
pp. 22296 ◽  
Author(s):  
Bobo Gu ◽  
Ming-Jie Yin ◽  
A. Ping Zhang ◽  
Jin-Wen Qian ◽  
Sailing He
Keyword(s):  
High Performance ◽  
Fiber Optic ◽  
Low Cost ◽  
Ph Sensor ◽  
High Performance Fiber ◽  
Core Fiber
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