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An analytical model for thermal failure analysis of 3D IC packaging
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
◽
10.1109/eurosime.2014.6813841
◽
2014
◽
Cited By ~ 1
Author(s):
Jia-Shen Lan
◽
Mei-Ling Wu
Keyword(s):
Failure Analysis
◽
Analytical Model
◽
3D Ic
◽
Thermal Failure
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
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Cited By
References
TSV Core Technology for 3D IC Packaging
Journal of Welding and Joining
◽
10.5781/kwjs.2009.27.3.004
◽
2009
◽
Vol 27
(3)
◽
pp. 4-9
Author(s):
Seung-Min Hyun
◽
Chang-Woo Lee
Keyword(s):
3D Ic
◽
Core Technology
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
3D IC Integration and 3D IC Packaging
Semiconductor Advanced Packaging
◽
10.1007/978-981-16-1376-0_7
◽
2021
◽
pp. 343-378
Author(s):
John H. Lau
Keyword(s):
3D Ic
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis
Microelectronics Reliability
◽
10.1016/j.microrel.2015.12.041
◽
2016
◽
Vol 61
◽
pp. 64-70
◽
Cited By ~ 28
Author(s):
Fa Xing Che
◽
Xiaowu Zhang
◽
Jong-Kai Lin
Keyword(s):
Finite Element Analysis
◽
Finite Element
◽
Reliability Study
◽
Element Analysis
◽
3D Ic
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
Fundamentals of Heat Dissipation in 3D IC Packaging
3D Microelectronic Packaging - Springer Series in Advanced Microelectronics
◽
10.1007/978-3-319-44586-1_10
◽
2017
◽
pp. 245-260
◽
Cited By ~ 3
Author(s):
Satish G. Kandlikar
◽
Amlan Ganguly
Keyword(s):
Heat Dissipation
◽
3D Ic
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
Reliability challenges in 3D IC packaging technology
Microelectronics Reliability
◽
10.1016/j.microrel.2010.09.031
◽
2011
◽
Vol 51
(3)
◽
pp. 517-523
◽
Cited By ~ 332
Author(s):
K.N. Tu
Keyword(s):
3D Ic
◽
Packaging Technology
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
Mechanical strength of thin Cu-TSV memory dies used in 3D IC packaging
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
◽
10.1109/impact.2015.7365247
◽
2015
◽
Cited By ~ 4
Author(s):
Y. C. Chao
◽
P. S. Huang
◽
H. T. Keng
◽
M. Y. Tsai
◽
P. C. Lin
Keyword(s):
Mechanical Strength
◽
3D Ic
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures
Microelectronic Engineering
◽
10.1016/j.mee.2013.12.005
◽
2014
◽
Vol 120
◽
pp. 85-89
◽
Cited By ~ 8
Author(s):
M. Lofrano
◽
B. Vandevelde
◽
M. Gonzalez
Keyword(s):
3D Ic
◽
Modeling Approach
◽
Induced Stress
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging
2013 IEEE 63rd Electronic Components and Technology Conference
◽
10.1109/ectc.2013.6575558
◽
2013
◽
Cited By ~ 8
Author(s):
Ranjith Samuel E. John
◽
Herman Meynen
◽
Sheng Wang
◽
Peng-Fei Fu
◽
Craig Yeakle
◽
...
Keyword(s):
Room Temperature
◽
Low Cost
◽
3D Ic
◽
3D Ic Packaging
◽
Ic Packaging
◽
Temporary Bonding
Download Full-text
Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging
Materials Chemistry and Physics
◽
10.1016/j.matchemphys.2012.02.074
◽
2012
◽
Vol 134
(1)
◽
pp. 340-344
◽
Cited By ~ 20
Author(s):
Ruo-Wei Yang
◽
Yuan-Wei Chang
◽
Wei-Chi Sung
◽
Chih Chen
Keyword(s):
Intermetallic Compounds
◽
3D Ic
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing
Microelectronics Reliability
◽
10.1016/j.microrel.2015.12.028
◽
2016
◽
Vol 59
◽
pp. 84-94
◽
Cited By ~ 10
Author(s):
Hsien-Chie Cheng
◽
Tzu-Chin Huang
◽
Po-Wen Hwang
◽
Wen-Hwa Chen
Keyword(s):
Heat Dissipation
◽
3D Ic
◽
Through Silicon Via
◽
Image Sensing
◽
3D Ic Packaging
◽
Ic Packaging
Download Full-text
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