A new gate driver circuit for improved turn-off characteristics of high current IGBT modules
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2019 ◽
Vol 7
◽
pp. 309-314
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Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling
2019 ◽
Vol 7
(1)
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pp. 99-107
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2004 ◽
Vol 5
(2)
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pp. 1-5
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