Process integration of 3D stacking for backside illuminated image sensor

Author(s):  
Zhi-Cheng Hsiao ◽  
Cheng-Ta Ko ◽  
Hsiang-Hung Chang ◽  
Huan-Chun Fu ◽  
Chao-Kai Hsu ◽  
...  
Nano Letters ◽  
2017 ◽  
Vol 17 (5) ◽  
pp. 3159-3164 ◽  
Author(s):  
Yu Horie ◽  
Seunghoon Han ◽  
Jeong-Yub Lee ◽  
Jaekwan Kim ◽  
Yongsung Kim ◽  
...  

Sensors ◽  
2019 ◽  
Vol 19 (24) ◽  
pp. 5572
Author(s):  
Isao Takayanagi ◽  
Ken Miyauchi ◽  
Shunsuke Okura ◽  
Kazuya Mori ◽  
Junichi Nakamura ◽  
...  

In this paper, a prototype complementary metal-oxide-semiconductor (CMOS) image sensor with a 2.8-μm backside-illuminated (BSI) pixel with a lateral overflow integration capacitor (LOFIC) architecture is presented. The pixel was capable of a high conversion gain readout with 160 μV/e− for low light signals while a large full-well capacity of 120 ke− was obtained for high light signals. The combination of LOFIC and the BSI technology allowed for high optical performance without degradation caused by extra devices for the LOFIC structure. The sensor realized a 70% peak quantum efficiency with a normal (no anti-reflection coating) cover glass and a 91% angular response at ±20° incident light. This 2.8-μm pixel is potentially capable of higher than 100 dB dynamic range imaging in a pure single exposure operation.


2016 ◽  
Vol 24 (14) ◽  
pp. 16027 ◽  
Author(s):  
Jong-Kwon Lee ◽  
Ahreum Kim ◽  
Dong-Wan Kang ◽  
Byung Yang Lee

Author(s):  
Shengkai Wang ◽  
Chuan Jin ◽  
Kai Qiao ◽  
Lei Yan ◽  
Gangcheng Jiao ◽  
...  

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