Process integration and 3D chip stacking for low cost backside illuminated CMOS image sensor

Author(s):  
Hsiang-Hung Chang ◽  
Zhi-Cheng Hsiao ◽  
Jen-Chun Wang ◽  
Chun-Hsien Chien ◽  
Cheng-Ta Ko ◽  
...  
2010 ◽  
Vol 2010 (1) ◽  
pp. 000378-000384
Author(s):  
Bioh Kim ◽  
Thorsten Matthias ◽  
Gerald Kreindl ◽  
Viorel Dragoi ◽  
Markus Wimplinger ◽  
...  

This article presents the advances in wafer-level processing and integration techniques for CMOS image sensor module manufacturing. CMOS image sensors gave birth to the low-cost, high-volume camera phone market and are being adopted for various high-end applications. The backside illumination technique has significant advantages over the front-side illumination due to separation of the optical path from the metal interconnects. Wafer bonding plays a key role in manufacturing backside illuminated sensors. The cost-effective integration of miniaturized cameras in various handheld devices becomes realized through the introduction of CMOS image sensor modules or camera modules manufactured with wafer-level processing and integration techniques. We developed various technologies enabling wafer-level processing and integration, such as (a) wafer-to-wafer permanent bonding with oxide or polymer layers for manufacturing backside illuminated sensor wafers, (b) wafer-level lens molding and stacking based on UV imprint lithography for making wafer-level optics, (c) conformal coating of various photoresists within high aspect ratio through-silicon vias, and (d) advanced backside lithography for various metallization processes in wafer-level packaging. Those techniques pave the way to the future growth of the digital imaging industry by improving the electrical and optical aspects of devices as well as the module manufacturability.


Nano Letters ◽  
2017 ◽  
Vol 17 (5) ◽  
pp. 3159-3164 ◽  
Author(s):  
Yu Horie ◽  
Seunghoon Han ◽  
Jeong-Yub Lee ◽  
Jaekwan Kim ◽  
Yongsung Kim ◽  
...  

Sensors ◽  
2019 ◽  
Vol 19 (24) ◽  
pp. 5461 ◽  
Author(s):  
Alain Küng ◽  
Benjamin A. Bircher ◽  
Felix Meli

Accurate traceable measurement systems often use laser interferometers for position measurements in one or more dimensions. Since interferometers provide only incremental information, they are often combined with index sensors to provide a stable reference starting point. Straightness measurements are important for machine axis correction and for systems having several degrees of freedom. In this paper, we investigate the accuracy of an optical two-dimensional (2D) index sensor, which can also be used in a straightness measurement system, based on a fiber-coupled, collimated laser beam pointing onto an image sensor. Additionally, the sensor can directly determine a 2D position over a range of a few millimeters. The device is based on a simple and low-cost complementary metal–oxide–semiconductor (CMOS) image sensor chip and provides sub-micrometer accuracy. The system is an interesting alternative to standard techniques and can even be implemented on machines for real-time corrections. This paper presents the developed sensor properties for various applications and introduces a novel error separation method for straightness measurements.


2016 ◽  
Vol 24 (14) ◽  
pp. 16027 ◽  
Author(s):  
Jong-Kwon Lee ◽  
Ahreum Kim ◽  
Dong-Wan Kang ◽  
Byung Yang Lee

Author(s):  
Shengkai Wang ◽  
Chuan Jin ◽  
Kai Qiao ◽  
Lei Yan ◽  
Gangcheng Jiao ◽  
...  

2014 ◽  
Vol 1049-1050 ◽  
pp. 1730-1735
Author(s):  
Yong Cheng Wang ◽  
He Ming Zhao ◽  
Lei Shao ◽  
Li He

In present paper, a DSP-based image capturing and transmitting system is described. As a shortage of peripherals on DSP, external image capturing and data transmitting components are needed in this case. A CMOS image sensor was used to capture images, and an Ethernet MAC controller with PHY was used to transmit image data. In addition, a CPLD was used as the co-controller for timing control. ARP, IP and UDP were functioning during data transmitting through Ethernet. The Driving Mechanism of two main chips and implementing of the protocols were described in detail. Images displayed on the PC show that the system provids good performance. The system is low-cost, simple and low-power.


Author(s):  
Zhi-Cheng Hsiao ◽  
Cheng-Ta Ko ◽  
Hsiang-Hung Chang ◽  
Huan-Chun Fu ◽  
Chao-Kai Hsu ◽  
...  

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