The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

2014 15th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2014.6922822 ◽

2014 ◽

Author(s):

Wang-Yun Li ◽

Hong-Bo Qin ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Electric Current ◽

Fracture Behavior ◽

Solder Joints ◽

Tensile Fracture ◽

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The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy ◽

10.1109/isaf.2014.6918031 ◽

2014 ◽

Author(s):

Wang-Yun Li ◽

Hong-Bo Qin ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Electric Current ◽

Fracture Behavior ◽

Solder Joints ◽

Tensile Fracture ◽

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Tensile Fracture Behavior of Sn-3.0Ag-0.5Cu Solder Joints on Copper

High Density Design Packaging and Microsystem Integration, 2007 International Symposium on ◽

10.1109/hdp.2007.4283617 ◽

2007 ◽

Author(s):

Ju Guo-kui ◽

Wei Xi-cheng ◽

Sun Peng ◽

Johan Liu

Keyword(s):

Fracture Behavior ◽

Solder Joints ◽

Tensile Fracture

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Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn–3.0Ag–0.5Cu/Cu joints

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480453 ◽

2018 ◽

Author(s):

Wen-Kai Le ◽

Xiang Ning ◽

Jia-Qiang Huang ◽

Min-Bo Zhou ◽

Xin-Ping Zhang

Keyword(s):

Shear Strength ◽

Electric Current ◽

Fracture Behavior ◽

Micro Scale ◽

Current Stressing

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Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

Materials Science and Engineering A ◽

10.1016/j.msea.2014.08.008 ◽

2014 ◽

Vol 617 ◽

pp. 14-23 ◽

Author(s):

H.B. Qin ◽

X.P. Zhang ◽

M.B. Zhou ◽

J.B. Zeng ◽

Y.-W. Mai

Keyword(s):

Fracture Behavior ◽

Solder Joints ◽

Micro Scale ◽

Constraint Effects

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Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583266 ◽

2016 ◽

Author(s):

Wang-Yun Li ◽

Shan-Shan Cao ◽

Xin-Ping Zhang

Keyword(s):

Size Effect ◽

Creep Deformation ◽

Fracture Behavior ◽

Solder Joints ◽

Micro Scale ◽

Deformation And Fracture

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Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints

Microelectronics Reliability ◽

10.1016/j.microrel.2015.05.013 ◽

2015 ◽

Vol 55 (8) ◽

pp. 1214-1225 ◽

Author(s):

H.B. Qin ◽

X.P. Zhang ◽

M.B. Zhou ◽

X.P. Li ◽

Y.-W. Mai

Keyword(s):

Fracture Behavior ◽

Solder Joints ◽

Mechanical Performance ◽

Ball Grid Array ◽

Geometry Effect ◽

Micro Scale ◽

Array Structure

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Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-021-06094-z ◽

2021 ◽

Author(s):

J. Ren ◽

M. L. Huang

Keyword(s):

Low Temperature ◽

Fracture Behavior ◽

Solder Joints ◽

Consumer Electronics ◽

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Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints

Engineering Failure Analysis ◽

10.1016/j.engfailanal.2021.105855 ◽

2021 ◽

pp. 105855

Author(s):

Ved Prakash Sharma ◽

Naresh V Datla

Keyword(s):

Fracture Behavior ◽

Solder Joints ◽

Bond Line ◽

Mode Mixity ◽

Line Thickness ◽

Bond Line Thickness

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Tensile Fracture Behavior of Cu/Al Butt Friction Stir Welding: Role of Interface Morphology

Journal of Materials Engineering and Performance ◽

10.1007/s11665-021-06281-3 ◽

2021 ◽

Author(s):

Tran Hung Tra ◽

Masakazu Okazaki ◽

Duong Dinh Hao

Keyword(s):

Friction Stir Welding ◽

Fracture Behavior ◽

Tensile Fracture ◽

Interface Morphology ◽

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Effect of electric current on fracture behavior of GaN piezoelectric semiconductive ceramics

Journal of the European Ceramic Society ◽

10.1016/j.jeurceramsoc.2018.09.012 ◽

2019 ◽

Vol 39 (2-3) ◽

pp. 316-322 ◽

Author(s):

GuoShuai Qin ◽

Xin Zhang ◽

MingHao Zhao ◽

Gang Wang

Keyword(s):

Electric Current ◽

Fracture Behavior

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