Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

2016 ◽  
Author(s):  
Wang-Yun Li ◽  
Shan-Shan Cao ◽  
Xin-Ping Zhang
Keyword(s):  
Size Effect ◽  
Creep Deformation ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Micro Scale ◽  
Deformation And Fracture

Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

2016 ◽  
Vol 685 ◽  
pp. 983-991 ◽  
Author(s):  
Z.L. Li ◽  
G.Y. Li ◽  
B. Li ◽  
L.X. Cheng ◽  
J.H. Huang ◽  
...  
Keyword(s):  
Size Effect ◽  
Solder Joints ◽  
Reflow Process ◽  
Micro Scale

Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

2011 ◽  
Vol 529 ◽  
pp. 468-478 ◽  
Author(s):  
Yanhong Tian ◽  
Chunjin Hang ◽  
Chunqing Wang ◽  
Shihua Yang ◽  
Pengrong Lin
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Shear Testing ◽  
Deformation And Fracture

An assessment of creep deformation and fracture behavior of 2.25Cr-1Mo similar and dissimilar weld joints

2001 ◽  
Vol 32 (1) ◽  
pp. 115-124 ◽  
Author(s):  
K. Laha ◽  
K. S. Chandravathi ◽  
K. Bhanu Sankara Rao ◽  
S. L. Mannan ◽  
D. H. Sastry
Keyword(s):  
Creep Deformation ◽  
Fracture Behavior ◽  
Dissimilar Weld ◽  
Weld Joints ◽  
Deformation And Fracture
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