Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

2014 ◽  
Vol 617 ◽  
pp. 14-23 ◽  
Author(s):  
H.B. Qin ◽  
X.P. Zhang ◽  
M.B. Zhou ◽  
J.B. Zeng ◽  
Y.-W. Mai
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Micro Scale ◽  
Constraint Effects

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010 ◽  
Vol 25 (7) ◽  
pp. 1312-1320 ◽  
Author(s):  
Y.L. Huang ◽  
K.L. Lin ◽  
D.S. Liu
Keyword(s):  
Fracture Energy ◽  
Microstructure Evolution ◽  
Thermal Cycle ◽  
Fracture Behavior ◽  
Solder Ball ◽  
Solder Joints ◽  
Whisker Formation ◽  
Structural Variations ◽  
Before And After ◽  
Ball Joints

The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

Recent Development on Fracture Analysis of Solder Joints

2014 ◽  
Vol 695 ◽  
pp. 680-683
Author(s):  
E.P. Ooi ◽  
R. Daud ◽  
N.A.M. Amin ◽  
T.W. Hong
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Electronic Devices ◽  
Fracture Analysis ◽  
Fracture Load ◽  
Mixed Mode Loading ◽  
Vibration Loading ◽  
Prevalent Fracture ◽  
Recent Fracture ◽  
Impact Vibration

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. In reality, the solder joints are exposed to drop impact, vibration loading, bending, and twisting of PCBs. Study on this matter will lead to prediction of fracture load, prevalent fracture mode, exact joint interconnect size and life of joints under brittle and fatigue failure. This paper presents a review of recent fracture analysis on solder joints.

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