Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads
Keyword(s):
Keyword(s):
2018 ◽
Vol 82
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pp. 224-227
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2009 ◽
Vol 40
(12)
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pp. 2927-2937
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2000 ◽
Vol 31
(4)
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pp. 1175-1185
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Keyword(s):
2001 ◽
Vol 32
(1)
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pp. 115-124
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Keyword(s):
2000 ◽
Vol 21
(3)
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pp. 191-198
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Keyword(s):
High-Temperature Deformation and Fracture Behavior of Cu–SiO2 Bicrystals with [011] Twist Boundaries
1996 ◽
Vol 37
(4)
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pp. 754-761
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1998 ◽
Vol 29
(3)
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pp. 1057-1069
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