Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads

Author(s):  
Wang-Yun Li ◽  
Shan-Shan Cao ◽  
Xin-Ping Zhang
2001 ◽  
Vol 32 (1) ◽  
pp. 115-124 ◽  
Author(s):  
K. Laha ◽  
K. S. Chandravathi ◽  
K. Bhanu Sankara Rao ◽  
S. L. Mannan ◽  
D. H. Sastry

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