Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration

2017 ◽  
Author(s):  
XingBo Liu ◽  
Mingliang Huang
Keyword(s):  
Intermetallic Compounds ◽  
Grain Orientation ◽  
Ni Substrate ◽  
Substrate Dissolution ◽  
Sn Grain Orientation

Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints

2013 ◽  
Vol 114 (15) ◽  
pp. 153509 ◽  
Author(s):  
Jian-Qiang Chen ◽  
Jing-Dong Guo ◽  
Kai-Lang Liu ◽  
Jian-Ku Shang
Keyword(s):  
Grain Orientation ◽  
Solder Joints ◽  
Sn Grain Orientation

Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate

2007 ◽  
Vol 22 (10) ◽  
pp. 2663-2667 ◽  
Author(s):  
Yee-wen Yen ◽  
Wei-kai Liou
Keyword(s):  
Intermetallic Compounds ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Lead Free ◽  
Lead Free Solder ◽  
Ni Substrate ◽  
Free Solder

This study investigates interfacial reactions of (Sn–9Zn) + xCu/Ni systems. Ni5Zn21, Cu5Zn8, (Ni,Zn,Cu)3Sn4, (Cu,Ni,Zn)6Sn5, and Cu6Sn5 phases were formed on the Sn–9Zn/Ni interface at 240–270 °C, when 0–10 wt% Cu was added to the Sn–9Zn solder. Experimental results indicate that changing the concentration of Cu in the Sn–9Zn solder dramatically changes the formation of intermetallic compounds (IMCs) in the (Sn–9Zn) + xCu/Ni system. Different diffusion and segregation rates of elements are the main reasons for a change in the IMC evolution.

Effects of Cu Contents in Sn–Cu Solder on the Composition and Morphology of Intermetallic Compounds at a Solder/Ni Interface

2005 ◽  
Vol 20 (8) ◽  
pp. 2205-2212 ◽  
Author(s):  
D.Q. Yu ◽  
C.M.L. Wu ◽  
D.P. He ◽  
N. Zhao ◽  
L. Wang ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Growth Mechanism ◽  
Solder Alloys ◽  
Cu Content ◽  
Ni Substrate ◽  
Evolution Tendency

The reaction between Sn–xCu (x = 0.1, 0.3, 0.7, 0.9, and 1.5 wt%) solder alloys and Ni at 260, 280, and 290 °C for 60 s was studied to reveal the effect of Cu content on the composition and morphology of intermetallic compounds (IMCs) formed at the interface between solder and substrate. The results indicated that Cu concentration greatly affects both the composition and morphology of the IMC between the solder and Ni substrate. In particular, when the Cu concentration was less than or equal to0.3 wt%, (CuxNi1−x)3Sn4 IMCs were formed at the interface. When the Cu concentration was 0.7 wt%, large facets type of (CuxNi1−x)6Sn5 were mixed with (CuxNi1−x)3Sn4 in the IMC layer. At Cu concentrations higher than the eutectic one, e.g., 0.9 and 1.5 wt%, stick-shaped (CuxNi1−x)6Sn5 compounds were detected, but the (CuxNi1−x)3Sn4 IMCs disappeared. The formation and growth mechanism of the (CuxNi1−x)6Sn5 compound were analyzed. The evolution tendency of the composition and morphology of the IMCs at the three testing temperatures was found to be the same.

Effect of electric field and Sn grain orientation on Cu consumption in Sn/Cu solder joint

2014 ◽  
Vol 95 ◽  
pp. 166-171 ◽  
Author(s):  
Jie-Shi Chen ◽  
Meng-Jia Xu ◽  
Yu-Jing Jin ◽  
Kai-Yun Wang ◽  
Yu Chun ◽  
...  
Keyword(s):  
Solder Joint ◽  
Electric Field ◽  
Grain Orientation ◽  
Sn Grain Orientation
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