Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

Deformation Mechanisms of NiP/Ni Composite Coatings on Ductile Substrates

NiP/Ni composite coatings with different thicknesses were prepared on coarse-grained Ni substrates by electrodeposition. The tensile tests show that compared with the substrate, the toughness and strength of the samples with multilayer composite coatings are greatly improved. The uniform elongation is increased from 24% to 43%, and the yield strength is increased from 108 to 172 MPa. In the deformation process, the geometrically necessary dislocations accumulate, resulting in long-range back stress, leading to strain hardening, showing synergistic strength and ductility. The mechanical properties of composite coatings are strongly affected by the layer thickness. Molecular dynamics studies show that there is a more uniform distribution of the shear strain in thinner coatings, and the propagation of shear transformation zones (STZs) is restrained, preventing the formation of a large shear band. With the decrease of thickness, the deformation of the NiP layer changes from shear fracture to the coexistence of uniform deformation and shear deformation. The interface resistance of the multilayer structure increases the resistance of crack propagation and alleviates the effects of NiP layer cracking on substrate cracking. Multilayer amorphous/crystalline coatings therefore may increase the toughness of the Ni substrate.

Preparation of Pd/PPy/Foam-Ni Electrode and its Electrocatalytic Hydrodechlorination of Dichlorophenols

Based on mechanism of ECH (Electrocatalytic Hydrogenation),the Pa/PPy/Foam-Ni (Pd/PPY/Ni) prepared by electrical depositing was used as cathode to detoxifythree kinds of dichlorophenol (DCP) and improve their biodegradability. According to the dechloridation ability of electrodes prepared under different conditions, the factors were optimized. The removal efficiency of 2,4-dichlorophenol（2,4-DCP）reaches 64.45% when the supporting electrolyte is p-toluenesulfonic acid and the voltage is 0.6V and polymerizing time is 20mins. Analyzing the photograph from SEM (Scanning Electron Microscope), it shows that PPy (PolyPyrrole) changes depositing properties of Pa on foam-Ni substrate, which increases specific surface area and special ductility so as to benefit Pd to deposite on Ni substrate and improve ECH.

The effect of substrate bias on the piezoelectric properties of pulse DC magnetron sputtered AlN thin films

Substrate bias was applied for AlN deposition on rolled Ni sheet during pulse DC reactive sputtering to overcome the difficulty caused by thermal expansion mismatch between Ni substrate and AlN upon substrate heating. It was shown by Piezoresponse Force Microscopy (PFM) that the quality of the deposited AlN layer depends strongly on the negative substrate bias, i.e., the energy transferred via the bombardment of the accelerated positive ions on the sample. As the negative substrate bias becomes larger, the so formed layer shows higher piezoresponse, and better homogeneity. A Z-cut LiNbO3 single crystal was used as a reference to correct the PFM signals. The highest average d33 piezoelectric coefficient value, achieved at − 100 V substrate bias, is 3.4 pm/V indicating the feasibility of AlN deposition on rolled Ni substrate for vibration energy harvesting applications.