Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
2007 ◽
Vol 22
(10)
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pp. 2663-2667
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Keyword(s):
This study investigates interfacial reactions of (Sn–9Zn) + xCu/Ni systems. Ni5Zn21, Cu5Zn8, (Ni,Zn,Cu)3Sn4, (Cu,Ni,Zn)6Sn5, and Cu6Sn5 phases were formed on the Sn–9Zn/Ni interface at 240–270 °C, when 0–10 wt% Cu was added to the Sn–9Zn solder. Experimental results indicate that changing the concentration of Cu in the Sn–9Zn solder dramatically changes the formation of intermetallic compounds (IMCs) in the (Sn–9Zn) + xCu/Ni system. Different diffusion and segregation rates of elements are the main reasons for a change in the IMC evolution.
2017 ◽
Vol 56
(1-2)
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pp. 108-112
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Keyword(s):
2006 ◽
Vol 41
(8)
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pp. 2359-2364
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Keyword(s):
2005 ◽
Vol 392
(1-2)
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pp. 192-199
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2020 ◽
Keyword(s):
2004 ◽
Vol 19
(12)
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pp. 3560-3568
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Keyword(s):
Keyword(s):
2011 ◽
Vol 23
(1)
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pp. 136-147
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Keyword(s):
2006 ◽
Vol 35
(1)
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pp. 89-93
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