Microstructure evolution and interfacial reaction of Co-P/SAC305/Co-P solder joints at high current density

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Tao Fan ◽  
Donghua Yang ◽  
Haotong Qin ◽  
Yuqian Chen ◽  
Tao Chen ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Microstructure Evolution ◽  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
High Current

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Keyword(s):  
Thermal Cycling ◽  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
High Current ◽  
Coupling Effects

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Daniel Straubinger ◽  
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Oliver Krammer ◽  
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...  
Keyword(s):  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Current ◽  
Chip Size ◽  
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Keyword(s):  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
High Current Density ◽  
High Current
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