Refractory metal carbide based diffusion barriers for copper metallization

2001 ◽  
Author(s):  
S.C. Sun ◽  
H.Y. Tsai ◽  
S.J. Wang
Keyword(s):  
Refractory Metal ◽  
Diffusion Barriers ◽  
Copper Metallization ◽  
Metal Carbide

Optimization of Copper Top-Side Metallization for High Performance SiC-Devices

2013 ◽  
Vol 740-742 ◽  
pp. 801-804 ◽  
Author(s):  
Tim Behrens ◽  
Thomas Suenner ◽  
Eckart Geinitz ◽  
Andreas Schletz ◽  
Lothar Frey
Keyword(s):  
Leakage Current ◽  
High Performance ◽  
High Reliability ◽  
Diffusion Barriers ◽  
Copper Layer ◽  
Copper Metallization ◽  
Adhesion Promoters ◽  
Peel Tests

While aluminum-based metallization schemes on Si have been optimized for the last decades, only few investigations have been done on copper metallization with SiC-devices. Thus, in this work the mechanical as well as the electrical interactions of this metallization system have been analyzed and optimized for SiC-devices in high reliability applications. For optimizing the adhesion of the copper metallization stack on SiC devices, different metallization schemes consisting of adhesion promoters (Ti, Cr, Al, Ta, WTi), diffusion barriers (TiN, Ta, WTi), and the final copper layer have been tested by peel-tests. For investigating the electrical interactions TLM measurements as well as leakage-current measurements have been done on copper metalized SiC samples.

Effect of annealing on the microstructure of ultrathin tungsten nitride diffusion barriers for copper metallization

2002 ◽  
Vol 64 (1-4) ◽  
pp. 269-277 ◽  
Author(s):  
M Hecker ◽  
R Hübner ◽  
R Ecke ◽  
S Schulz ◽  
H.-J Engelmann ◽  
...  
Keyword(s):  
Diffusion Barriers ◽  
Copper Metallization ◽  
Tungsten Nitride

Reaction bonded refractory metal carbide/carbon composites

Polyhedron ◽  
1994 ◽  
Vol 13 (8) ◽  
pp. 1315-1327 ◽  
Author(s):  
Andrew N. MacInnes ◽  
Andrew R. Barron ◽  
Jason J. Li ◽  
Thomas R. Gilbert
Keyword(s):  
Refractory Metal ◽  
Carbon Composites ◽  
Metal Carbide
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