A Novel Wet Metallization on Photo-Imageable Dielectric Material with High T-Peel Adhesion Using Pd Nanoparticle Catalyst and Micro Surface Roughening

2020 ◽  
Author(s):  
Jia-Yi Guo ◽  
Tzu-Chien Wei
Keyword(s):  
Dielectric Material ◽  
Surface Roughening ◽  
Pd Nanoparticle ◽  
Peel Adhesion ◽  
Nanoparticle Catalyst

scholarly journals Product selective reaction controlled by the combination of palladium nanoparticles, continuous microwave irradiation, and a co-existing solid; ligand-free Buchwald–Hartwig amination vs. aryne amination

2021 ◽  
Author(s):  
Makito Yamada ◽  
Ryousuke Ohta ◽  
Kazuo Harada ◽  
Tsunayoshi Takehara ◽  
Hitoshi Haneoka ◽  
...  
Keyword(s):  
Microwave Irradiation ◽  
Palladium Nanoparticles ◽  
Copper Plate ◽  
Pd Nanoparticle ◽  
Selective Reaction ◽  
Ligand Free ◽  
Nanoparticle Catalyst

We have developed a continuous microwave irradiation-assisted Buchwald–Hartwig amination using our original Pd nanoparticle catalyst with a copper plate as a co-existing metal solid.

Advanced Chemical Processes for Semi-additive PWB fabrication for Fine Line Formation Targeting Line and Space=5μm/5μm

2015 ◽  
Vol 2015 (1) ◽  
pp. 1-4 ◽  
Author(s):  
Satoshi Kawashima ◽  
Kazutaka Tajima
Keyword(s):  
Dielectric Material ◽  
Selective Dissolution ◽  
Chemical Processes ◽  
Surface Finishing ◽  
Surface Roughening ◽  
Line Formation ◽  
Additive Process ◽  
Fine Line ◽  
Finishing Process ◽  
Electroless Copper

Demand of powerful & fast computing requires the packaging configured with finer lines. The current requirement for Line and Space (L/S) is around 10μm/10μm, it will go down to less than that and 5 μm/5 μm is industry's target in our site. To achieve this miniaturization, a number of improvements are ongoing in equipment, material and chemical for surface finishing process. It seems there is a threshold which requires non-contiguous improvement for the miniaturization. The improvement in surface finishing process requires finer surface roughening for Dielectric material, selective dissolution of metals, or same metal made by different method such as Electroless copper and Electroplated copper, which never exist in the industry. In this paper, advanced chemical processes for semi-additive process (SAP) to fabricate PWB with fine line formation targeting L/S =5μm/5μm are reported. The series of improvements of chemical process enables confidence to manufacture fine lines which L/S=5μm/5μm using finer surface roughening of Electroless copper seed for better Dry Film Resist (DFR) formation, better stripping of the DFR, selective dissolution of Electroless copper seed, finer surface roughening for Solder Mask application, etc.

scholarly journals An extremely highly recoverable clay-supported Pd nanoparticle catalyst for solvent-free Heck–Mizoroki reactions

RSC Advances ◽  
2015 ◽  
Vol 5 (74) ◽  
pp. 59983-59990 ◽  
Author(s):  
Alejandro V. Martínez ◽  
Alejandro Leal-Duaso ◽  
José I. García ◽  
José A. Mayoral
Keyword(s):  
Palladium Nanoparticles ◽  
Solvent Free ◽  
Heck Reactions ◽  
Pd Nanoparticle ◽  
Recoverable Catalysts ◽  
Catalytic Cycles ◽  
Supported Pd ◽  
Nanoparticle Catalyst

Palladium nanoparticles supported onto LAPONITE® clay are shown to be robust and highly recoverable catalysts (up to 75 catalytic cycles) for Mizoroki–Heck reactions.

Access to highly active Ni–Pd bimetallic nanoparticle catalysts for C–C coupling reactions

2016 ◽  
Vol 6 (14) ◽  
pp. 5567-5579 ◽  
Author(s):  
Rohit K. Rai ◽  
Kavita Gupta ◽  
Deepika Tyagi ◽  
Arup Mahata ◽  
Silke Behrens ◽  
...  
Keyword(s):  
Charge Transfer ◽  
Atomic Ratio ◽  
Electronic Charge ◽  
Coupling Reactions ◽  
Pd Nanoparticle ◽  
Nanoparticle Catalysts ◽  
Bimetallic Nanoparticle ◽  
Highly Active ◽  
Electronic Charge Transfer ◽  
Nanoparticle Catalyst

A facile access to highly active (with enhanced TONs/TOFs) and durable bimetallic Ni–Pd nanoparticle catalysts for C–C coupling reactions was achieved by tuning Ni to Pd atomic ratio in the Ni–Pd nanoparticle catalyst and therefore the electronic charge transfer from Ni to Pd.

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