2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Predictive Modelling Methodologies for Bi-material Strip Warpage

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268561 ◽

2020 ◽

Author(s):

Jenn An Wang ◽

Ong. Kang Eu ◽

Wen Hsin Weng ◽

Chih Chung Hsu ◽

Wei Keat Loh ◽

...

Keyword(s):

Predictive Modelling

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Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268570 ◽

2020 ◽

Author(s):

F. ROUSTAIE ◽

S. QUEDNAU ◽

F. DASSINGER ◽

O. BIRLEM

Keyword(s):

Room Temperature ◽

Fine Pitch

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Study of Electromigration of Solder Microbumps by 3D X-ray Microscopy

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268536 ◽

2020 ◽

Author(s):

Tzu-Wen Lin ◽

Kai-Cheng Shie ◽

Chih Chen ◽

King-Ning Tu

Keyword(s):

X Ray

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Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268605 ◽

2020 ◽

Author(s):

T. Y. Ou-Yang ◽

H. H. Chang ◽

C. K. Hsu ◽

H. C. Fu ◽

Y. S. Liao

Keyword(s):

Temporary Bonding

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Copper Surface Preparation to Enhance Absorption of Carbon Dioxide Laser Energy in Blind Micro-via Formation

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268573 ◽

2020 ◽

Author(s):

N. Wood ◽

P. Brooks ◽

T. Thomas ◽

T. Huelsmann ◽

T. Koenigsmann ◽

...

Keyword(s):

Carbon Dioxide ◽

Carbon Dioxide Laser ◽

Laser Energy ◽

Surface Preparation ◽

Copper Surface

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SiON waveguide and polymer waveguide for optical interconnects of silicon photonics

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268551 ◽

2020 ◽

Author(s):

C. C. Hsiao ◽

H. H. Chang ◽

H. C. Fu ◽

W. C. Lee ◽

S. C. Chen ◽

...

Keyword(s):

Silicon Photonics ◽

Optical Interconnects ◽

Polymer Waveguide

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The investigation of the correlation between electroless nickel immersion gold and high-speed signal transmission (IMPACT 2020)

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268595 ◽

2020 ◽

Author(s):

Ian Yi-En Su ◽

Chih-Hao Huang ◽

Chris Hansen ◽

Yu-Shyan Lin

Keyword(s):

High Speed ◽

Signal Transmission ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold

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Study Of Dsp (Tms320f2812) Chip For Advanced Photovoltaic Power Generation Maximum Power Point Tracking Control System

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268608 ◽

2020 ◽

Author(s):

Shusen Kuang ◽

Kuo-Chi Chang ◽

Kai-Chun Chu ◽

Yuh-Chung Lin ◽

Hsiao-Chuan Wang ◽

...

Keyword(s):

Power Generation ◽

Control System ◽

Tracking Control ◽

Maximum Power Point Tracking ◽

Maximum Power ◽

Maximum Power Point ◽

Point Tracking ◽

Power Point Tracking ◽

Photovoltaic Power ◽

Power Point

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Research of mechanical properties of Copper foils with low temperature annealing.

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268600 ◽

2020 ◽

Author(s):

Chuan-Yu Fang ◽

Chih Chen

Keyword(s):

Mechanical Properties ◽

Low Temperature ◽

Copper Foils ◽

Low Temperature Annealing

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Agenda

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268548 ◽

2020 ◽

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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Predictive Modelling Methodologies for Bi-material Strip Warpage

Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

Study of Electromigration of Solder Microbumps by 3D X-ray Microscopy

Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration

Copper Surface Preparation to Enhance Absorption of Carbon Dioxide Laser Energy in Blind Micro-via Formation

SiON waveguide and polymer waveguide for optical interconnects of silicon photonics

The investigation of the correlation between electroless nickel immersion gold and high-speed signal transmission (IMPACT 2020)

Study Of Dsp (Tms320f2812) Chip For Advanced Photovoltaic Power Generation Maximum Power Point Tracking Control System

Research of mechanical properties of Copper foils with low temperature annealing.

Agenda

Export Citation Format

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Predictive Modelling Methodologies for Bi-material Strip Warpage

Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

Study of Electromigration of Solder Microbumps by 3D X-ray Microscopy

Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration

Copper Surface Preparation to Enhance Absorption of Carbon Dioxide Laser Energy in Blind Micro-via Formation

SiON waveguide and polymer waveguide for optical interconnects of silicon photonics

The investigation of the correlation between electroless nickel immersion gold and high-speed signal transmission (IMPACT 2020)

Study Of Dsp (Tms320f2812) Chip For Advanced Photovoltaic Power Generation Maximum Power Point Tracking Control System

Research of mechanical properties of Copper foils with low temperature annealing.

Agenda

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications