2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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9781728198514

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IMPACT 2020 Cover Page

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268593 ◽

2020 ◽

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Enhanced Board Level Design Methodology by Statistical Analysis

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268598 ◽

2020 ◽

Author(s):

Denis Chen ◽

Jimmy Hsu ◽

Thonas Su ◽

YL Li

Keyword(s):

Statistical Analysis ◽

Design Methodology ◽

Level Design ◽

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Agenda

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268548 ◽

2020 ◽

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Predictive Modelling Methodologies for Bi-material Strip Warpage

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268561 ◽

2020 ◽

Author(s):

Jenn An Wang ◽

Ong. Kang Eu ◽

Wen Hsin Weng ◽

Chih Chung Hsu ◽

Wei Keat Loh ◽

...

Keyword(s):

Predictive Modelling

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Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268570 ◽

2020 ◽

Author(s):

F. ROUSTAIE ◽

S. QUEDNAU ◽

F. DASSINGER ◽

O. BIRLEM

Keyword(s):

Room Temperature ◽

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Study of Electromigration of Solder Microbumps by 3D X-ray Microscopy

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268536 ◽

2020 ◽

Author(s):

Tzu-Wen Lin ◽

Kai-Cheng Shie ◽

Chih Chen ◽

King-Ning Tu

Keyword(s):

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Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268605 ◽

2020 ◽

Author(s):

T. Y. Ou-Yang ◽

H. H. Chang ◽

C. K. Hsu ◽

H. C. Fu ◽

Y. S. Liao

Keyword(s):

Temporary Bonding

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Copper Surface Preparation to Enhance Absorption of Carbon Dioxide Laser Energy in Blind Micro-via Formation

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268573 ◽

2020 ◽

Author(s):

N. Wood ◽

P. Brooks ◽

T. Thomas ◽

T. Huelsmann ◽

T. Koenigsmann ◽

...

Keyword(s):

Carbon Dioxide ◽

Carbon Dioxide Laser ◽

Laser Energy ◽

Surface Preparation ◽

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SiON waveguide and polymer waveguide for optical interconnects of silicon photonics

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268551 ◽

2020 ◽

Author(s):

C. C. Hsiao ◽

H. H. Chang ◽

H. C. Fu ◽

W. C. Lee ◽

S. C. Chen ◽

...

Keyword(s):

Silicon Photonics ◽

Optical Interconnects ◽

Polymer Waveguide

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The investigation of the correlation between electroless nickel immersion gold and high-speed signal transmission (IMPACT 2020)

2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact50485.2020.9268595 ◽

2020 ◽

Author(s):

Ian Yi-En Su ◽

Chih-Hao Huang ◽

Chris Hansen ◽

Yu-Shyan Lin

Keyword(s):

Signal Transmission ◽

Electroless Nickel ◽

Electroless Nickel Immersion Gold

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