Large-scale InP photonic integrated circuit packaged with ball grid array for 2D optical beam steering

Author(s):  
Weihua Guo ◽  
Pietro R. A. Binetti ◽  
Milan L. Masanovic ◽  
Leif A. Johansson ◽  
Larry A. Coldren
Author(s):  
Weihua Guo ◽  
Pietro R. A. Binetti ◽  
Chad Althouse ◽  
Ashish Bhardwaj ◽  
Jonathan Doylend ◽  
...  

Photonics ◽  
2018 ◽  
Vol 5 (3) ◽  
pp. 21 ◽  
Author(s):  
Charidimos Chaintoutis ◽  
Behnam Shariati ◽  
Adonis Bogris ◽  
Paul Dijk ◽  
Chris Roeloffzen ◽  
...  

Data centers are continuously growing in scale and can contain more than one million servers spreading across thousands of racks; requiring a large-scale switching network to provide broadband and reconfigurable interconnections of low latency. Traditional data center network architectures, through the use of electrical packet switches in a multi-tier topology, has fundamental weaknesses such as oversubscription and cabling complexity. Wireless intra-data center interconnection solutions have been proposed to deal with the cabling problem and can simultaneously address the over-provisioning problem by offering efficient topology re-configurability. In this work we introduce a novel free space optical interconnect solution for intra-data center networks that utilizes 2D optical beam steering for the transmitter, and high bandwidth wide-area photodiode arrays for the receiver. This new breed of free space optical interconnects can be developed on a photonic integrated circuit; offering ns switching at sub-μW consumption. The proposed interconnects together with a networking architecture that is suitable for utilizing those devices could support next generation intra-data center networks, fulfilling the requirements of seamless operation, high connectivity, and agility in terms of the reconfiguration time.


Author(s):  
Weihua Guo ◽  
Pietro R. A. Binetti ◽  
Chad Althouse ◽  
Huub P.M.M. Ambrosius ◽  
Leif A. Johansson ◽  
...  

Author(s):  
Weihua Guo ◽  
Pietro R. A. Binetti ◽  
Chad Althouse ◽  
Huub P.M.M. Ambrosius ◽  
Leif A. Johansson ◽  
...  

Author(s):  
Weihua Guo ◽  
Pietro R. A. Binetti ◽  
Chad Althouse ◽  
Huub P.M.M. Ambrosius ◽  
Leif A. Johansson ◽  
...  

Author(s):  
Weihua Guo ◽  
Pietro R. A. Binetti ◽  
Chad Althouse ◽  
Huub P.M.M. Ambrosius ◽  
Leif A. Johansson ◽  
...  

Author(s):  
Weihua Guo ◽  
Pietro R. A. Binetti ◽  
Chad Althouse ◽  
Huub P. M. M. Ambrosius ◽  
Leif A. Johansson ◽  
...  

Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1646
Author(s):  
Jingya Xie ◽  
Wangcheng Ye ◽  
Linjie Zhou ◽  
Xuguang Guo ◽  
Xiaofei Zang ◽  
...  

In the last couple of decades, terahertz (THz) technologies, which lie in the frequency gap between the infrared and microwaves, have been greatly enhanced and investigated due to possible opportunities in a plethora of THz applications, such as imaging, security, and wireless communications. Photonics has led the way to the generation, modulation, and detection of THz waves such as the photomixing technique. In tandem with these investigations, researchers have been exploring ways to use silicon photonics technologies for THz applications to leverage the cost-effective large-scale fabrication and integration opportunities that it would enable. Although silicon photonics has enabled the implementation of a large number of optical components for practical use, for THz integrated systems, we still face several challenges associated with high-quality hybrid silicon lasers, conversion efficiency, device integration, and fabrication. This paper provides an overview of recent progress in THz technologies based on silicon photonics or hybrid silicon photonics, including THz generation, detection, phase modulation, intensity modulation, and passive components. As silicon-based electronic and photonic circuits are further approaching THz frequencies, one single chip with electronics, photonics, and THz functions seems inevitable, resulting in the ultimate dream of a THz electronic–photonic integrated circuit.


2015 ◽  
Vol 1 (8) ◽  
pp. e1500257 ◽  
Author(s):  
Chuang Zhang ◽  
Chang-Ling Zou ◽  
Yan Zhao ◽  
Chun-Hua Dong ◽  
Cong Wei ◽  
...  

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.


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