Failure Analysis and Reliability Improvement of the Corner Region of Variation Lateral Doping Termination

2021 ◽  
Author(s):  
Min Ren ◽  
Xuefan Zhang ◽  
Xin Zhang ◽  
Junwei Feng ◽  
Yahan Yang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Corner Region ◽  
Reliability Improvement

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

Sign in / Sign up

Export Citation Format

Share Document