An advanced reliability improvement and failure analysis approach to thermal stress issues in IC packages

Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.


Author(s):  
Hashim Ismail ◽  
Ang Chung Keow ◽  
Kenny Gan Chye Siong

Abstract An output switching malfunction was reported on a bridge driver IC. The electrical verification testing revealed evidence of an earlier over current condition resulting from an abnormal voltage sense during a switching event. Based on these test results, we developed the hypothesis that a threshold voltage mismatch existed between the sense transistor and the output transistor. This paper describes the failure analysis approach we used to characterize the threshold voltage mismatch as well as our approach to determine the root cause, which was trapped charge on the gate oxide of the sense transistor.


2012 ◽  
Author(s):  
Ali Abdul-Aziz ◽  
Galib Abumeri ◽  
William Troha ◽  
Ramakrishna T. Bhatt ◽  
Joseph E. Grady ◽  
...  

2005 ◽  
Vol 128 (1) ◽  
pp. 25-32 ◽  
Author(s):  
Gerry C. Slagis

The ASME Section III design-by-analysis approach provides stress criteria for the design of nuclear components. Stresses are calculated elastically for the most part, although plastic analysis is recognized. Limits are specified for primary, secondary, and peak stresses. Inherent in these limits are factors of safety against several modes of failure. The purpose of this paper is to explain the design-by-analysis criteria and fundamental concepts behind the approach. Topics covered include the bases for the primary stress limits, shakedown to elastic action, fatigue, simplified elastic-plastic analysis, and thermal stress ratchet. Issues that are explored are separating primary and secondary stresses in finite element analyses, material ductility requirements, and the meaning of the fatigue penalty factor.


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