Experimental characterization of photoconductive antennas for tunable continuous-wave THz generation

Author(s):  
Kiwon Moon ◽  
Jeongyoung Choi ◽  
Namje Kim ◽  
Han-Cheol Ryu ◽  
Sang-Pil Han ◽  
...  
Author(s):  
Ramesh Singh ◽  
Shreyes N. Melkote

There is growing demand for micro and meso scale devices in the field of optics, semiconductors and bio-medical devices. In response to this demand, mechanical micro-cutting (e.g. micro-turning, micro-milling) is emerging as a viable alternative to lithography based micromachining techniques. However, certain factors limit the types of workpiece materials that can be processed using mechanical micromachining methods. For difficult-to-machine materials such as mold and die steels, limitations in cutting tool stiffness and strength are major impediments to the use of mechanical micromachining methods. This paper presents a Laser Assisted Mechanical Micromachining (LAMM) process that involves highly localized thermal softening of the hard material by focusing a solid-state continuous wave/pulsed laser beam in front of a miniature (100μm–1mm wide) cutting tool. By suitably controlling the laser power, location and spot size, it is possible to cause a sufficiently large decrease in the strength of the work material and thereby minimize catastrophic tool failure and lower tool forces and deflection. This paper presents the results of experimental characterization of the LAMM process. Micro scale grooving experiments are conducted on H-13 mold steel (42 HRc) in order to understand the influence of the laser variables (laser power, beam location with respect to tool) and cutting parameters (depth of cut, cutting speed and tool width) on the cutting forces and surface finish. The results show that, for a given cutting condition, these process responses are significantly influenced by the laser variables. Plausible explanations for the observed trends are given.


2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.


AIAA Journal ◽  
2002 ◽  
Vol 40 ◽  
pp. 16-25
Author(s):  
J. P. Wojno ◽  
T. J. Mueller ◽  
W. K. Blake

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