Optically initiated spatial modulation of THz radiation at far-field distances using a Compressed Sensing protocol

Author(s):  
S. Augustin ◽  
P. Jung ◽  
S. Frohmann ◽  
H.-W. Hubers
2018 ◽  
Vol 17 (2) ◽  
pp. 794-807 ◽  
Author(s):  
Lixia Xiao ◽  
Yue Xiao ◽  
Chao Xu ◽  
Xia Lei ◽  
Ping Yang ◽  
...  

Author(s):  
Robin Zatta ◽  
Daniel Headland ◽  
Eamal Ashna ◽  
Ritesh Jain ◽  
Philipp Hillger ◽  
...  

AbstractArrays of terahertz (THz) sources provide a pathway to overcoming the radiation power limitations of single sources. Several independent sources of THz radiation may be implemented in a single integrated circuit, thereby realizing a monolithic THz source array of high output power. Integrated THz sources must generally be backside-coupled to extended hemispherical dielectric lenses in order to suppress substrate modes and extract THz power. However, this lens also increases antenna gain and thereby produces several non-overlapping beams. This is because individual source pixels are relatively large. Hence, their spatial separation on-chip translates to angular separation in the far-field. In other words, there are gaps in their field of view into which very little THz power is projected. Therefore, they cannot homogeneously illuminate an imaging target. This article presents a simple, practical, and scalable method to convert arrays of incoherent THz sources into a diffuse, uniform illumination source without the need for reducing pixel size. Briefly, individual beam divergence is optimized by tailoring the dimensions of the extended hemispherical dielectric lens such that the far-field beams of adjacent source pixels overlap and combine to form a uniform far-field beam. We applied this method to an incoherent 8 × 8-pixel THz source array radiating 10.3 dBm at 0.42 THz as a proof of concept and thereby realized a 10.3-dBm 0.42-THz diffuse, uniform illumination source that was then deployed in a demonstration of THz active imaging.


2017 ◽  
Vol 2017 ◽  
pp. 1-6 ◽  
Author(s):  
Wei Ren ◽  
Guan Gui ◽  
Fei Li

Signal detection is one of the fundamental problems in three-dimensional multiple-input multiple-output (3D-MIMO) wireless communication systems. This paper addresses a signal detection problem in 3D-MIMO system, in which spatial modulation (SM) transmission scheme is considered due to its advantages of low complexity and high-energy efficiency. SM based signal transmission typically results in the block-sparse structure in received signals. Hence, structured compressed sensing (SCS) based signal detection is proposed to exploit the inherent block sparsity information in the received signal for the uplink (UL). Moreover, normalization preprocessing is considered before iteration process with the purpose of preventing the noise from being overamplified by the column vector with inadequately large elements. Simulation results are provided to show the stable and reliable performance of the proposed algorithm under both Gaussian and non-Gaussian noise, in comparison with methods such as compressed sensing based detectors, minimum mean square error (MMSE), and zero forcing (ZF).


2016 ◽  
Vol 2 (6) ◽  
pp. e1600190 ◽  
Author(s):  
Rayko Ivanov Stantchev ◽  
Baoqing Sun ◽  
Sam M. Hornett ◽  
Peter A. Hobson ◽  
Graham M. Gibson ◽  
...  

Terahertz (THz) imaging can see through otherwise opaque materials. However, because of the long wavelengths of THz radiation (λ = 400 μm at 0.75 THz), far-field THz imaging techniques suffer from low resolution compared to visible wavelengths. We demonstrate noninvasive, near-field THz imaging with subwavelength resolution. We project a time-varying, intense (>100 μJ/cm2) optical pattern onto a silicon wafer, which spatially modulates the transmission of synchronous pulse of THz radiation. An unknown object is placed on the hidden side of the silicon, and the far-field THz transmission corresponding to each mask is recorded by a single-element detector. Knowledge of the patterns and of the corresponding detector signal are combined to give an image of the object. Using this technique, we image a printed circuit board on the underside of a 115-μm-thick silicon wafer with ~100-μm (λ/4) resolution. With subwavelength resolution and the inherent sensitivity to local conductivity, it is possible to detect fissures in the circuitry wiring of a few micrometers in size. THz imaging systems of this type will have other uses too, where noninvasive measurement or imaging of concealed structures is necessary, such as in semiconductor manufacturing or in ex vivo bioimaging.


1999 ◽  
Author(s):  
F. Hilbk-Kortenbruck ◽  
Peter H. Bolivar ◽  
Rainer Martini ◽  
Henricus P. M. Pellemans ◽  
Heinrich Kurz

Optica ◽  
2017 ◽  
Vol 4 (8) ◽  
pp. 989 ◽  
Author(s):  
Rayko I. Stantchev ◽  
David B. Phillips ◽  
Peter Hobson ◽  
Samuel M. Hornett ◽  
Miles J. Padgett ◽  
...  

Author(s):  
Marco Donald Migliore ◽  
Benjamin Fuchs ◽  
Laurent Le Coq ◽  
Laurent Ferro-Famil

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